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ST0893 Calcium Manganate Sputtering Target, CaMnO3

Chemical FormulaCaMnO3
Catalog No.ST0893
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Calcium Manganate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Calcium Manganate Sputtering Target Description

The Calcium Manganate Sputtering Target is used in thin film deposition through physical vapor deposition (PVD). In this process, thin films are deposited onto a substrate by bombarding a solid target with high-energy particles in a vacuum chamber.

The target itself is a solid disc made from a compound of calcium (Ca) and manganate (MnO₃). It is usually produced by compressing and sintering powdered calcium manganate.

Calcium Manganate Sputtering Target Specifications

Compound FormulaCaMnO3
AppearanceWhite target
Molecular Weight143.01
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Calcium Manganate Sputtering Target Handling Notes

Indium bonding is recommended for the Calcium Manganate Sputtering Target due to its characteristics that can pose challenges during sputtering, such as brittleness and low thermal conductivity. The material’s low thermal conductivity also makes it prone to thermal shock, so indium bonding helps to enhance its stability and performance in the sputtering process.

Calcium Manganate Sputtering Target Application

The Calcium Manganate Sputtering Target is utilized in the production of Copper Indium Gallium Selenide (CIGS) solar cells, which are thin-film photovoltaic devices. CIGS solar cells are known for their high efficiency and flexibility, making them ideal for applications such as building-integrated photovoltaics.

Calcium Manganate Sputtering Target Packaging

We ensure that our Calcium Manganate Sputtering Targets are meticulously handled during storage and transportation to maintain their quality and keep them in their original condition.

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TFM offers Calcium Manganate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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