Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
Germanium Antimony Sputtering Target

ST0969 Germanium Antimony Sputtering Target, Ge-Sb

Chemical FormulaGe-Sb
Catalog No.ST0969
CAS Number–
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

TFM offers Germanium Antimony Sputtering Targets with exceptional purity, reflecting our extensive expertise in materials science. We are dedicated to providing competitive pricing and tailored solutions that meet the high standards required for advanced applications in nanotechnology and thin-film deposition.

MSDS File

Germanium Antimony Sputtering Target Description

Germanium Antimony Sputtering Targets are essential materials used in the sputtering process for depositing thin films on substrates, a technique crucial for various technological applications. These thin films are particularly valuable in fields such as electronics and optoelectronics.

Germanium Antimony alloys are notable for their role in phase change memory devices, leveraging their unique properties to enhance non-volatile memory technologies. Additionally, Germanium Antimony thin films are beneficial in optoelectronic devices, including sensors and detectors, where their distinctive characteristics provide a significant advantage.

TFM’s Germanium Antimony Sputtering Targets are designed to meet the rigorous standards required by both research scientists and industry professionals, ensuring high performance and reliability in advanced applications.

Related Product: Germanium Sputtering Target

Germanium Antimony Sputtering Target Specifications

Compound FormulaGe-Sb
AppearanceSilver Metallic Target
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Germanium Antimony Sputtering Target Handling Notes

Indium bonding is recommended for Germanium Antimony Sputtering Targets to address the material’s challenges, such as brittleness and low thermal conductivity. This bonding method enhances the target’s performance during sputtering by mitigating issues related to thermal shock and improving overall stability. Proper handling and bonding ensure the longevity and effectiveness of the sputtering process, maintaining the quality of the thin films produced.

Germanium Antimony Sputtering Target Application

1. Microelectronics:

  • Semiconductor Coatings: Germanium Antimony Sputtering Targets are used to deposit thin films for semiconductors, enhancing the performance of transistors, diodes, and other microelectronic devices.
  • Conductive and Dielectric Layers: The high electrical conductivity and chemical stability make these targets suitable for creating both conductive and dielectric layers, which are crucial for improving the performance and reliability of electronic components.

2. Optics:

  • Optical Coatings: The targets are employed to create coatings for optical components such as lenses and mirrors. Their high refractive index and excellent optical properties make them ideal for applications in imaging, spectroscopy, and laser technology.
  • Enhanced Optical Performance: These coatings improve light transmission and reflection characteristics, contributing to the effectiveness of optical devices.

3. Solar Energy:

  • Anti-Reflective Coatings: Germanium Antimony Sputtering Targets are used to apply anti-reflective coatings on solar cells. The high absorption coefficient of these targets increases the efficiency of solar cells by enhancing sunlight absorption.
  • Improved Energy Conversion: The coatings help convert more sunlight into electricity, thus improving the overall performance of solar energy systems.

4. Research and Development:

  • Thin-Film Deposition Research: The unique properties of Germanium Antimony make it valuable for fundamental research on thin-film deposition processes.
  • Material Studies: These targets support studies of physical and chemical properties of thin films, aiding advancements in material science and deposition technologies.

These versatile applications highlight the importance of Germanium Antimony Sputtering Targets in advancing technology across various fields.

Germanium Antimony Sputtering Target Packaging

Our Germanium Antimony Sputtering Target is meticulously managed throughout storage and transportation to ensure it arrives in optimal condition. Each target is carefully packaged and protected to maintain its quality and performance, safeguarding against any potential damage or degradation.

Get Contact

TFM offers Germanium Antimony Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Reviews

There are no reviews yet.

Be the first to review “ST0969 Germanium Antimony Sputtering Target, Ge-Sb”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top