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ST0984 Germanium Arsenide Selenide Sputtering Target, Ge-As-Se

Chemical FormulaGe-As-Se
Catalog No.ST0984
CAS Number57673-50-4
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

With a strong emphasis on high quality and affordability, TFM specializes in Germanium Arsenide Selenide Sputtering Targets. Our commitment to excellence ensures that clients receive exceptional products at competitive prices, making our sputtering targets a preferred choice in the industry.

Germanium Arsenide Selenide Sputtering Target Description

Germanium Arsenide Selenide Sputtering Targets are distinguished by a range of key attributes that make them highly valuable in advanced technological applications. These targets are renowned for their excellent electrical conductivity, which is essential for the production of high-performance electronic devices. They also demonstrate impressive thermal stability, allowing them to perform reliably even under high-temperature and thermal stress conditions. This quality makes them well-suited for use in the fabrication of electronic components.

Additionally, Germanium Arsenide Selenide Sputtering Targets are noted for their superior chemical stability. They can handle complex manufacturing environments with ease, maintaining consistent performance throughout the process.

In addition to their role in electronics, these sputtering targets are also pivotal in the fields of optoelectronics and laser technology. Their unique optical properties are crucial for the production of precision components and devices in these areas. Germanium Arsenide Selenide targets enhance the performance and accuracy of optoelectronic and laser applications, highlighting their importance across various high-tech sectors.

Overall, the diverse and advanced properties of Germanium Arsenide Selenide Sputtering Targets make them a vital material in driving innovation and efficiency in multiple high-tech industries.

Related Product: Copper Gallium Selenide Sputtering Target, Bismuth Antimony Selenide Sputtering Target

Germanium Arsenide Selenide Sputtering Target Specifications

Compound FormulaGe-As-Se
AppearanceGray Target
Melting Point>360℃
Density4.4-4.62 g/cm3
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Germanium Arsenide Selenide Sputtering Target Handling Notes

For Germanium Arsenide Selenide Sputtering Targets, Indium bonding is advised due to the material’s inherent properties that make conventional sputtering methods less effective. This target material is characterized by its brittleness and low thermal conductivity, which can lead to issues such as thermal shock during the sputtering process. Indium bonding helps to mitigate these challenges by providing a more stable and reliable attachment, ensuring consistent performance and durability of the sputtering targets under operational conditions.

Germanium Arsenide Selenide Sputtering Target Application

Indium bonding is recommended for Germanium Arsenide Selenide Sputtering Targets due to the material’s unique properties, which can pose challenges for traditional sputtering techniques. The material’s brittleness and low thermal conductivity make it prone to thermal shock, potentially impacting performance during sputtering. By employing Indium bonding, these issues are effectively addressed. Indium provides a more stable and reliable connection, enhancing the target’s durability and ensuring consistent performance throughout the sputtering process.

Germanium Arsenide Selenide Sputtering Target Packaging

We meticulously handle our Germanium Arsenide Selenide Sputtering Targets during both storage and transportation to ensure they remain in pristine condition, maintaining their high quality and performance.

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TFM offers Germanium Arsenide Selenide Sputtering Targets in a range of forms, purities, and sizes. We are experts in producing high-purity physical vapor deposition (PVD) materials with optimal density and minimal average grain sizes. Our targets are suitable for applications in semiconductor manufacturing, chemical vapor deposition (CVD), and physical vapor deposition (PVD) for display and optical technologies.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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