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ST0912 Inconel 600 Sputtering Targets, Ni/Cr/Fe

Chemical FormulaNi/Cr/Fe
Catalog No.ST0912
CAS NumberN/A
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Inconel 600 sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Inconel 600 Sputtering Targets Description

The Inconel 600 Sputtering Target is a specialized material utilized in the sputter deposition process to produce thin films for a range of applications, including electronics, aerospace, and other industrial fields.

During sputtering, high-energy ions bombard the Inconel 600 Sputtering Target, causing atoms or molecules to be ejected. These ejected particles then deposit onto a substrate, forming a thin film of Inconel 600. The resulting thin film retains the key properties of Inconel 600, such as excellent corrosion resistance and high-temperature stability.

Related Product: Nickel Telluride Sputtering Target, Nickel Titanium Sputtering Target, Nickel Tungsten Sputtering Target

Inconel 600 Sputtering Targets Specifications

Compound FormulaNi/Cr/Fe
Molecular WeightN/A
AppearanceMetallic solid
Melting Point (℃)1,395
Boiling Point (℃)N/A
Theoretical Density (g/cm3)8.5
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Inconel 600 Sputtering Targets Application

The Inconel 600 Sputtering Target is particularly suitable for applications in extreme environments, including high-temperature and corrosive conditions. Its inherent properties, such as exceptional heat resistance and corrosion resistance, make it ideal for use in demanding industrial settings where durability and reliability are essential.

Inconel 600 Sputtering Targets Packaging

Our Inconel 600 Sputtering Targets are meticulously handled throughout storage and transportation to maintain the integrity and quality of the products in their original condition.

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TFM offers Inconel 600 Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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