Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
iron-nitride-sputtering-target-fen4-removebg-preview

ST0212 Iron Nitride Sputtering Target, FeN4

Chemical Formula: FeN4
Catalog Number: ST0212
CAS Number: 37245-77-5
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Iron Nitride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Iron Nitride Sputtering Target Description

Iron Nitride sputtering target from TFM is a nitride ceramic sputtering material with the chemical formula FeN4. This material is commonly used in thin film deposition processes, including applications in electronics, semiconductors, and various coating industries. Iron Nitride is valued for its magnetic properties and hardness, making it suitable for a range of advanced technological applications.

ironIron, also known as ferrum, is a chemical element with the symbol “Fe,” derived from its Latin name. It is one of the most widely used and historically significant metals, with usage dating back to before 5000 BC. Iron has an atomic number of 26 and is located in Period 4, Group 8 of the periodic table, within the d-block. The relative atomic mass of iron is approximately 55.845, with the value in brackets indicating the measurement uncertainty. Iron is a fundamental element in the Earth’s crust and plays a crucial role in various biological and industrial processes.

Related Product: Iron Sputtering Target

NitrogenNitrogen, symbolized by “N,” is a chemical element derived from the Greek words ‘nitron’ and ‘genes,’ meaning nitre-forming. It was first identified and described in 1772 by the scientist Daniel Rutherford. Nitrogen has an atomic number of 7, placing it in Period 2 and Group 15 of the periodic table, within the p-block. This element is characterized by a relative atomic mass of approximately 14.0067, with the value in brackets indicating the measurement uncertainty. Nitrogen is a major component of the Earth’s atmosphere and plays a vital role in various biological and chemical processes.

Iron Nitride Sputtering Target Application

The iron nitride sputtering target is widely utilized in thin film deposition for a range of applications, including decorative coatings, semiconductor manufacturing, displays, LEDs, and photovoltaic devices. It is also used for functional coatings in industries such as optical information storage, glass coatings for automotive and architectural applications, and optical communication systems. The versatility of iron nitride in these high-tech fields makes it a valuable material for enhancing the performance and durability of various products and technologies.

Iron Nitride Sputtering Target Packaging

Our iron nitride sputtering target is meticulously tagged and labeled externally to ensure efficient identification and maintain strict quality control standards. We take exceptional care in handling and packaging the product to prevent any damage that could occur during storage or transportation, ensuring that it reaches you in optimal condition.

Get Contact

TFM offers Iron Nitride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Reviews

There are no reviews yet.

Be the first to review “ST0212 Iron Nitride Sputtering Target, FeN4”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top