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ST0499 Nickel Iron Sputtering Target, Ni/Fe

Chemical Formula: Ni/Fe
Catalog Number: ST0499
Purity: 99%~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Nickel Iron sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Nickel Iron Sputtering Target Description

NickelNickel is a chemical element whose name is derived from the German term “kupfernickel,” which translates to either “devil’s copper” or “St. Nicholas’s copper.” It was first described in 1751 by F. Cronstedt, who also accomplished its isolation. The canonical symbol for nickel is “Ni,” and it has an atomic number of 28. Nickel is situated in Period 4 and Group 10 of the periodic table, and it belongs to the d-block. Its relative atomic mass is 58.6934(2) Dalton, with the number in parentheses reflecting the uncertainty.

ironIron, known chemically as ferrum, originates from the Anglo-Saxon term “iren” and the Latin word “ferrum.” It has been used since before 5000 BC. The canonical symbol for iron is “Fe,” and it has an atomic number of 26. Located in Period 4 and Group 8 of the periodic table, iron is part of the d-block elements. Its relative atomic mass is 55.845(2) Dalton, with the number in parentheses indicating the uncertainty.

Related Products: Nickel Sputtering Target, Iron Sputtering Target.

Nickel Iron Sputtering Target Specifications

Material TypeNickel Iron
SymbolNi/Fe
Color/AppearanceSolid
Melting Point/
Density/
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Nickel Iron Sputtering Target Application

The Nickel Iron Sputtering Target is employed in various applications, including thin film deposition, decorative coatings, and semiconductor manufacturing. It is suitable for use in displays, LED technology, and photovoltaic devices. Additionally, this target is utilized in functional coatings, optical information storage, and the glass coating industry, encompassing both automotive and architectural glass. It also plays a role in optical communication technologies.

Packing

Our Nickel Iron Sputtering Targets are meticulously tagged and labeled externally to facilitate accurate identification and stringent quality control. We take exceptional care to prevent any damage during storage or transportation, ensuring the targets arrive in optimal condition.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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