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ST1000 Nickel Sulfide Sputtering Target, NiS

Embark on a journey into the world of precision with Nickel Sulfide Sputtering Targets, offered by TFM. Crafted with meticulous attention, these sputtering targets guarantee exceptional quality and performance, making them the superior choice for precise thin-film deposition.

MSDS File

Nickel Sulfide Sputtering Target Description

Nickel Sulfide Sputtering Targets offer distinct properties that are crucial for various applications. Known for their high purity, these targets are essential in achieving precise thin-film deposition. The unique composition of Nickel Sulfide provides excellent electrical conductivity, making them valuable for electronic and semiconductor manufacturing. Additionally, their outstanding thermal stability makes them suitable for high-temperature applications. Their optical properties also make them relevant for optical coatings and thin-film technologies. Overall, the combination of purity, electrical conductivity, thermal stability, and optical characteristics makes Nickel Sulfide Sputtering Targets versatile and important for advancing technology in multiple domains.

Related Product: Aluminum Nickel Sputtering Target, Chromium Nickel Sputtering Target

Nickel Sulfide Sputtering Target Specifications

Compound FormulaNiS
Molecular Weight90.75
AppearanceYellow Target
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Nickel Sulfide Sputtering Target Handling Notes

Indium bonding is recommended for Nickel Sulfide Sputtering Targets due to their brittleness and low thermal conductivity, which can make sputtering challenging. Nickel Sulfide’s low thermal conductivity and susceptibility to thermal shock further necessitate the use of indium bonding to ensure effective performance and reliability during sputtering.

Nickel Sulfide Sputtering Target Application

Nickel Sulfide Sputtering Targets are essential in various advanced technological applications. They are primarily used in thin-film deposition processes, making them crucial for electronic and semiconductor manufacturing due to their high purity and excellent electrical conductivity. Their outstanding thermal stability allows them to perform well in high-temperature environments, aiding in the production of durable electronic components. Additionally, Nickel Sulfide’s optical properties make it valuable for optical coatings and thin-film technologies, enhancing their use in sensors and optoelectronics. Overall, Nickel Sulfide Sputtering Targets are pivotal in advancing technology across electronic, optical, and semiconductor fields.

Nickel Sulfide Sputtering Target Packaging

Our Nickel Sulfide Sputtering Target is meticulously handled during both storage and transportation to ensure it maintains its high quality and original condition.

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TFM’s Nickel Sulfide Sputtering Target is offered in a range of forms, purities, and sizes. We excel in producing high-purity physical vapor deposition (PVD) materials, ensuring the highest density and smallest average grain sizes. Our targets are designed for use in semiconductor, chemical vapor deposition (CVD), and physical vapor deposition (PVD) applications, including display and optical technologies.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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