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ST0106 Nickel Tungsten Sputtering Target, Ni/W

Chemical Formula:Ā Ni/W
Catalog Number:Ā ST0106
CAS Number:Ā 7440-02-0 | 7440
Purity:Ā 99.9%, 99.95%
Shape:Ā Discs, Plates, Column Targets, Step Targets, Custom-made

Nickel TungstenĀ  sputtering targetĀ  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Nickel Tungsten Sputtering Target Description

The Nickel Tungsten Sputtering Target from TFM is an alloy material composed of nickel (Ni) and tungsten (W). This high-quality sputtering material is designed for applications that benefit from the combined properties of these two elements.

NickelNickel, symbolized as “Ni,” is a chemical element whose name is derived from the shortened German term ā€˜kupfernickel,ā€™ meaning either devilā€™s copper or St. Nicholasā€™s copper. It was first mentioned and observed by F. Cronstedt in 1751, who also accomplished its isolation. Nickel has an atomic number of 28 and is located in Period 4, Group 10 of the d-block in the periodic table. Its relative atomic mass is 58.6934(2) Daltons, with the number in brackets indicating the measurement uncertainty.

Related Product:Ā Nickel Sputtering Target

TungstenTungsten, also known as wolfram (with the symbol “W”), is a chemical element whose name originates from the Swedish words ā€˜tung sten,ā€™ meaning heavy stone. The symbol “W” comes from its old name, wolfram, after the tungsten mineral wolframite. Tungsten was first mentioned in 1781 and observed by T. Bergman. Its isolation was later accomplished and announced by J. and F. Elhuyar. Tungsten has an atomic number of 74 and is located in Period 6, Group 6 of the d-block in the periodic table. Its relative atomic mass is 183.84(1) Daltons, with the number in brackets indicating the measurement uncertainty.

Related Product:Ā Tungsten Sputtering Target

Nickel Tungsten Sputtering Target Application

The Nickel Tungsten Sputtering Target is widely used for thin film deposition in various industries. Its applications include decoration, semiconductors, displays, LED and photovoltaic devices, and functional coatings. Additionally, it is utilized in the optical information storage industry, glass coating for car and architectural glass, optical communication, and other related fields.

Nickel Tungsten Sputtering TargetĀ Packing

Our Nickel Tungsten Sputtering Targets are meticulously handled to prevent any damage during storage and transportation. This careful handling ensures that our products maintain their original quality and arrive in perfect condition.

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TFM offers Nickel Tungsten Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

Itā€™s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Alā‚‚Oā‚ƒ, SiOā‚‚, TiOā‚‚), alloys, or compositesā€”chosen based on the filmā€™s desired properties.

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They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

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In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

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Key factors include the targetā€™s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

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Operators monitor target erosion (often by measuring the depth of the eroded ā€œrace trackā€) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

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Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

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DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the targetā€™s surface.

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In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also ā€œpoisonā€ the target surface if not carefully controlled.

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Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

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Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

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