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ST0106 Nickel Tungsten Sputtering Target, Ni/W

Chemical Formula:Ā Ni/W
Catalog Number:Ā ST0106
CAS Number:Ā 7440-02-0 | 7440
Purity:Ā 99.9%, 99.95%
Shape:Ā Discs, Plates, Column Targets, Step Targets, Custom-made

Nickel TungstenĀ  sputtering targetĀ  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Nickel Tungsten (Ni/W) Sputtering Targets are advanced alloy materials widely used in thin film deposition where a balance of mechanical strength, corrosion resistance, and electrical performance is required. By combining the ductility and conductivity of nickel with the hardness and high-temperature stability of tungsten, Ni/W targets enable the deposition of durable, functional coatings for demanding industrial and electronic applications.

Detailed Description

Nickel Tungsten Sputtering Targets are typically produced through powder metallurgy or vacuum melting processes to ensure homogeneous composition and high density. The Ni/W ratio can be tailored (commonly ranging from Ni-rich to W-rich compositions) depending on the desired film properties, such as hardness, conductivity, or resistance to oxidation.

The addition of tungsten significantly enhances the wear resistance, thermal stability, and mechanical strength of nickel-based films. At the same time, nickel improves the overall ductility and sputtering efficiency, allowing for more stable deposition compared to pure tungsten targets.

These targets are available in planar or rotatable forms and are often bonded to copper backing plates using indium or elastomer bonding to improve heat dissipation during sputtering. A dense, fine-grained microstructure is essential for minimizing arcing and particle generation, ensuring consistent film thickness and surface quality.

Ni/W coatings are particularly valued for their resistance to corrosion and erosion, as well as their ability to maintain performance under high-temperature or chemically aggressive environments.

Applications

Nickel Tungsten Sputtering Targets are widely used in:

  • Corrosion-resistant coatings for harsh environments
  • Wear-resistant and hard coatings for mechanical components
  • Semiconductor and microelectronic thin films
  • Barrier layers and diffusion-resistant coatings
  • Decorative coatings with enhanced durability
  • Energy systems and functional coatings

Technical Parameters

ParameterTypical Value / RangeImportance
CompositionNi/W (e.g., 80/20, 70/30 wt%)Determines film properties
Purity99.9% – 99.99%Ensures consistent deposition
Density≄ 98% theoreticalImproves sputtering stability
Diameter50 – 300 mm (custom available)Compatible with sputtering systems
Thickness3 – 6 mmAffects target lifetime
BondingCopper backing / Indium bondingEnhances thermal conductivity
MicrostructureFine, homogeneousReduces defects and arcing

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Nickel Tungsten (Ni/W)Balanced hardness and corrosion resistanceFunctional and protective coatings
Nickel (Ni)High conductivity, ductilityConductive layers
Tungsten (W)Extreme hardness, high melting pointHigh-temperature coatings

FAQ

QuestionAnswer
Can Ni/W sputtering targets be customized?Yes, composition ratios, size, and bonding options can be tailored to your requirements.
What sputtering method is suitable for Ni/W?Both DC and RF magnetron sputtering can be used depending on system configuration.
What is the advantage of alloying Ni with W?It improves hardness, wear resistance, and thermal stability while maintaining good sputtering performance.
Are bonded targets necessary?For high-power applications, bonded targets improve heat dissipation and structural stability.
Which industries use Ni/W targets most?Semiconductor, energy, aerospace, and advanced coating industries.

Packaging

Our Nickel Tungsten Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.

Conclusion

Nickel Tungsten Sputtering Targets offer a versatile solution for high-performance thin film deposition, combining the strengths of both nickel and tungsten. With customizable compositions and reliable manufacturing quality, they are ideal for demanding industrial and research applications.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Alā‚‚Oā‚ƒ, SiOā‚‚, TiOā‚‚), alloys, or composites—chosen based on the film’s desired properties.

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They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

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In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

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Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

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Operators monitor target erosion (often by measuring the depth of the eroded ā€œrace trackā€) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

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Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

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DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

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In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also ā€œpoisonā€ the target surface if not carefully controlled.

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Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

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Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

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