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ST0890 Niobium Titanium Sputtering Target, Nb/Ti

Niobium Titanium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Niobium Titanium Sputtering Target Description

The Niobium Titanium Sputtering Target is utilized in sputtering, a technique commonly used for thin film deposition. In this process, high-energy particles, typically ions, bombard the solid target material, causing atoms or ions to be ejected. These ejected particles are then deposited onto a substrate to create a thin film.

Niobium Titanium Sputtering Target Specifications

Compound FormulaTi/Nb
AppearanceGray metallic target
Molecular Weight140.773
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Niobium Titanium Sputtering Target Handling Notes

Indium bonding is recommended for the Niobium Titanium Sputtering Target because its inherent properties, such as brittleness and low thermal conductivity, can make sputtering challenging. The material’s low thermal conductivity also makes it prone to thermal shock, so indium bonding helps to improve its performance and durability during the sputtering process.

Niobium Titanium Sputtering Target Application

The Niobium Titanium Sputtering Target is extensively used in applications such as semiconductors, superconductors, sensor technologies, optical coatings, and various other fields that require precise thin film deposition.

Niobium Titanium Sputtering Target Packaging

We meticulously handle our Niobium Titanium Sputtering Targets during storage and transportation to ensure they retain their quality and remain in their original condition.

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TFM offers Niobium Titanium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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