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ST0919 Vanadium Oxide Sputtering Target, V2O3

Chemical FormulaV2O3
Catalog No.ST0919
CAS Number1314-34-7
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Vanadium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Vanadium Oxide Sputtering Target Description

Vanadium Oxide Sputtering Target is a specialized material utilized in the sputter deposition process. This technique is widely used for producing thin films in various applications such as electronics, optics, and coatings.

The sputtering target consists of high-purity vanadium(III) oxide (V₂O₃), ensuring a controlled and precise deposition of vanadium oxide onto substrates during the thin-film deposition process.

Related Product: Vanadium Nitride Sputtering Target

Vanadium Oxide Sputtering Target Specifications

Compound FormulaV2O3
Molecular Weight149.88
AppearanceBlack Target
Melting Point1940℃
Density (g/cm3)4.339
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Vanadium Oxide Sputtering Target Handling Notes

Indium bonding is recommended for the Vanadium Oxide Sputtering Target due to its inherent characteristics, such as brittleness and low thermal conductivity, which can affect sputtering performance. Vanadium oxide, with its low thermal conductivity and susceptibility to thermal shock, benefits from indium bonding to enhance stability and performance during the sputtering process.

Vanadium Oxide Sputtering Target Application

Vanadium Oxide Sputtering Target is utilized in the fabrication of electronic devices and components.

Vanadium Oxide Sputtering Target Packaging

Our Vanadium Oxide Sputtering Target is meticulously handled during storage and transportation to ensure the preservation of its original quality.

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TFM offers Vanadium Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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