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Bismuth Manganate Sputtering Target, Bi3MnO3

Bismuth Manganate Sputtering Target, Bi3MnO3

Chemical Formula: Bi2.4MnO3, BiMnO3, Bi3MnO3
Catalog Number: TFM-SPT-0068
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Bismuth Manganate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Product Overview

Bismuth Manganate Sputtering Target (Bi3MnO3) is a composition-specific sputtering target for thin-film deposition and PVD process development. The practical specification normally includes chemistry, purity, dimensions, density, target configuration, and any bonding or backing requirement needed by the sputtering cathode.

Material and Deposition Characteristics

Power mode and process conditions should be selected according to the target conductivity, thermal behavior, and the requirements of the cathode system. For less common materials, conservative initial power density and film-composition verification are good practice.

Technical Data

ParameterTypical Value / RangeImportance
Chemical CompositionBi₃MnO₃Ensures correct multiferroic behavior
Purity99.9% – 99.99%Reduces impurity-related electrical defects
Diameter25 – 200 mm (custom available)Compatible with standard sputtering guns
Thickness3 – 6 mmInfluences sputtering lifetime and rate
Density≥ 95% theoreticalImproves plasma stability and film uniformity
BondingUnbonded / Cu or Ti backing (optional)Enhances heat dissipation
MaterialKey AdvantageTypical Application
Bi₃MnO₃Combined ferroelectric and magnetic propertiesMultiferroic thin films
Bismuth Ferrite (BiFeO₃)Strong room-temperature multiferroicityMemory and spintronics
Manganese Oxide (Mn₃O₄)Simple magnetic oxideMagnetic and catalytic coatings
QuestionAnswer
Can the Bi₃MnO₃ sputtering target be customized?Yes, diameter, thickness, purity, and bonding options can be tailored.
Is RF sputtering required for this target?Yes, Bi₃MnO₃ is a ceramic oxide and is typically used with RF sputtering systems.
How is the target packaged?Vacuum-sealed with protective cushioning and export-grade cartons or crates.
Is the target suitable for high-temperature deposition?Yes, when properly bonded, it performs well under elevated sputtering power.

Typical Thin-Film Applications

  • Thin-film research and materials-development projects requiring a composition-specific sputtering source
  • Semiconductor, optical, energy, electronic, or laboratory coatings depending on the material system
  • Custom R&D work where target composition, purity, and geometry need to be specified together

Target Configuration and Ordering Considerations

For quotation and manufacturability review, provide target size, thickness, purity or alloy composition, quantity, and the sputtering gun or cathode model if known. If a bonded assembly is required, include backing-plate material, bonding preference, and any dimensional tolerances, surface-finish needs, or inspection-document requirements. TFM can also review customer drawings or old-target samples for replacement builds.

Frequently Asked Questions

What is the main reason to use a Bismuth Manganate sputtering target?

It provides a composition-specific source for thin-film deposition when the target material itself is important to the desired film chemistry or process.

How should the sputtering mode for Bismuth Manganate be selected?

The power mode should be chosen according to target conductivity, thermal behavior, and equipment capability. Less-conductive materials are commonly evaluated with RF power.

Why are density and microstructure important for Bismuth Manganate targets?

These factors can influence erosion stability, thermal behavior, particle generation, and the risk of cracking or local hot spots.

Can Bismuth Manganate be supplied with a backing plate?

Yes. If the material is brittle or the cathode requires it, a bonded configuration can be reviewed according to target size, thickness, cooling, and power.

Does target composition always equal film composition?

No. Film chemistry may differ because of sputtering yields, process conditions, substrate temperature, re-sputtering, and chamber history. Film verification is recommended when composition matters.

What should I provide to request a quotation for Bismuth Manganate?

Please provide the composition, purity, dimensions, quantity, target configuration, cathode details, and any drawing or inspection requirements.

Order Now

BiMnO3 Sputtering Target, Indium Bonded 2mm Copper Plate, Bi2.4MnO3 Sputtering Target, Indium Bonded 2mm Copper Plate, Bi3MnO3 Sputtering Target, Indium Bonded 2mm Copper Plate

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

Manufacturing routes depend on the material and target specification. Metal targets may be cast and machined, while some ceramic targets are consolidated by sintering. Ask for the product-specific route and inspection criteria when these affect qualification.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Bonding may be selected for brittle targets, thinner precious-metal targets, or a cathode that needs a specific backing and cooling arrangement. It is not a universal requirement. Provide target and backing dimensions, the cathode model, and operating conditions for assembly review.

 

DC is commonly used with conductive targets. RF is often used for poorly conducting or insulating targets to mitigate surface charging; other power modes may be suitable depending on the target, cathode, and process. Confirm the mode against the equipment and material.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Customer-supplied powder acceptance is not assumed. Provide material identity, lot traceability, composition and impurity analysis, quantity, and handling constraints in the RFQ. TFM must confirm feasibility and acceptance criteria before any material is sent.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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