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Tin Antimonide Sputtering Target

ST0943 Tin Antimonide Sputtering Target, SnSb

Chemical FormulaSnSb
Catalog No.ST0943
CAS Number28980-49-6
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Tin Antimonide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

The Tin Antimonide Sputtering Target (SnSb) is a compound alloy target widely used in thin-film deposition for phase-change materials, thermoelectric research, and advanced electronic devices. By combining tin (Sn) and antimony (Sb), SnSb enables the deposition of films with controllable electrical resistivity, crystallization behavior, and thermal stability—key requirements in modern data storage, memory devices, and functional thin-film applications.

SnSb sputtering targets are especially valued in research and pilot-scale production environments where precise stoichiometry and reproducible sputtering performance are essential.

Detailed Description

Tin Antimonide sputtering targets are manufactured from high-purity tin and antimony raw materials using controlled melting, alloying, and precision machining processes. The resulting target exhibits uniform composition, stable microstructure, and consistent density—factors that directly influence sputtering rate stability and film uniformity.

SnSb targets can be supplied in various atomic or weight ratios depending on application requirements, allowing fine control over phase-change temperature, electrical conductivity, and optical contrast in deposited films. During magnetron sputtering, SnSb demonstrates stable plasma interaction and predictable target erosion behavior, making it suitable for both R&D and small-to-medium production runs.

Targets are available as monolithic alloy discs or bonded to copper or titanium backing plates to improve heat dissipation and power handling, particularly under higher sputtering power conditions.

Applications

Tin Antimonide sputtering targets are commonly used in:

  • Phase-change memory (PCM) and data storage research

  • Thermoelectric thin films and devices

  • Semiconductor and electronic materials development

  • Infrared and optoelectronic coatings

  • Functional alloy thin films

  • Academic and industrial thin-film R&D

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionSn–Sb (custom ratios available)Controls electrical & phase behavior
Purity99.9% – 99.99%Improves film consistency
Target Diameter25 – 300 mm (custom)Compatible with standard guns
Thickness3 – 6 mm (custom)Influences sputtering stability
Density≥ 99% of theoreticalEnsures uniform erosion
Backing PlateOptional (Cu / Ti)Enhances thermal management
Deposition MethodDC / RF Magnetron SputteringProcess flexibility

Comparison with Related Sputtering Targets

MaterialKey AdvantageTypical Application
Tin Antimonide (SnSb)Tunable phase-change behaviorMemory & thermoelectrics
Germanium Antimony Telluride (GST)Fast phase switchingPCM devices
Antimony Telluride (Sb₂Te₃)Thermoelectric efficiencyIR & TE devices
Tin Telluride (SnTe)Narrow bandgap semiconductorInfrared applications

FAQ

QuestionAnswer
Can the Sn/Sb ratio be customized?Yes, composition can be tailored to specific research or process needs.
Is bonding recommended?Bonded targets are recommended for higher power or larger diameters.
Is DC sputtering suitable?Yes, DC sputtering is commonly used for SnSb alloy targets.
Are small research targets available?Yes, lab-scale diameters and thicknesses are supported.
How is the target packaged?Vacuum-sealed with protective cushioning for safe delivery.

Packaging

Our Tin Antimonide Sputtering Targets are meticulously tagged and labeled for accurate identification and quality traceability. Each target is vacuum-sealed and protected with anti-static and shock-absorbing materials to prevent contamination or mechanical damage during storage and transportation. Export-grade cartons or wooden crates are used when required.

Conclusion

The Tin Antimonide Sputtering Target (SnSb) provides a reliable material solution for depositing phase-change and functional alloy thin films with controlled electrical and thermal properties. With customizable composition, stable sputtering behavior, and dependable quality, SnSb targets are an excellent choice for advanced thin-film research and electronic material development.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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