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CF Flanged SS Copper Bonnet Bellows Sealed Gate Valves (Manual)

Gate Valves for Semiconductor, R&D, and Industrial Applications from TFM

TFM’s gate valves are engineered for use in semiconductor, research and development (R&D), and various industrial processes. They are commonly employed to isolate pumps and sample entry locks from high vacuum (HV) or ultra-high vacuum (UHV) work chambers, ensuring efficient operation.

Key Features

  • CF Flanged with Copper Gasket: These valves function effectively in atmospheric pressures down to 10⁻¹¹ torr and are bakeable up to 200°C, providing versatility in demanding environments.
  • General Purpose Polished Stainless Steel: The polished finish enhances durability and ensures a clean operation.
  • Compact Design with High Conductance: Optimized for space-saving without compromising performance, these valves deliver excellent flow characteristics.
  • Long Service Life: Capable of enduring up to 100,000 cycles before maintenance is needed, ensuring reliability and reduced downtime.

Choose TFM’s gate valves for dependable performance in critical applications.

Specifications Table

ManufacturerTFM
PressureTorr
Min: 7.500 x 10-9 Torr
Max: 760 Torrmbar
Min: 1.000 x 10-8 mbar
Max: 1013 mbar
RatesHelium Leak Rate
1.000 x 10-9 mbar*L/s
7.520 x 10-10 Torr*L/s
TemperatureActuator
60.0 ºC
140 ºFBakeable
120 ºC
248 ºF
Shaft Seal
Material		Bellows Sealed
Cycle
Life		10,000
Actuator
Type		Manual
Max Differential Pressure
Before Open		22.5  Torr
Bonnet
Seal Type		Fluorocarbon (FKM)
Valve Body
Material		Stainless Steel
Valve Seal
Material		Fluorocarbon (FKM)

Ordering Table

Drawing Flange Size Bonnet Seal Type Thread Part Number
Tooltip DN35CF-DN40CF (2.75" OD) Copper M6 GU0150MCCFM
Tooltip DN63CF (4.50" OD) Copper M8 GU0250MCCFM
Tooltip DN100CF (6.00" OD) Copper M8 GU0400MCCFM
Tooltip DN160CF (8.00" OD) Copper M8 GU0600MCCFM
Tooltip DN200CF (10.00" OD) Copper M8 GU0800MCCFM

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FAQ

Sputtering targets are materials used in thin-film deposition processes to create coatings on substrates. They are used in industries like semiconductors, optics, photovoltaics, and electronics.

Evaporation materials are used in Physical Vapor Deposition (PVD) processes, where materials are heated and evaporated to form a thin film on a substrate. These are critical for applications in optics, wear protection, and decorative coatings.

Boat crucibles are used as containers for evaporation materials during PVD processes. They help to uniformly evaporate materials onto the substrate for thin film formation.

Sputtering uses energetic particles to eject material from a target, while evaporation involves heating a material until it vaporizes and deposits on a substrate. Both are common methods in Physical Vapor Deposition (PVD) for creating thin films.

Consider the material composition, purity, target size, and application-specific requirements such as the thickness and uniformity of the film.

Yes, we offer customized sputtering targets, evaporation materials, and crucibles to meet specific customer requirements for size, material composition, and purity.

Yes, we can assist in selecting the most suitable material based on your application, whether it’s for optical coatings, semiconductor fabrication, or decorative finishes.

Yes, we offer both bulk and small quantities of sputtering targets, evaporation materials, and spherical powders to support research, prototyping, and development projects.

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