CF Flanged SS Copper Bonnet Gate Valve (Manual)

CF Flanged SS Copper Bonnet Gate Valve (Manual)

The CF Flanged Stainless Steel (SS) Copper Bonnet Gate Valve is a robust manual valve designed for effective flow regulation in demanding industrial settings. With its corrosion-resistant stainless steel body and copper bonnet, this valve ensures long-lasting performance and reliability.

Key Features:

  • Stainless Steel Body: Built with high-quality stainless steel, this gate valve offers excellent resistance to corrosion and wear, making it suitable for harsh environments.
  • Copper Bonnet: The copper bonnet provides added durability and enhances the valve’s heat resistance, especially in high-temperature applications.
  • CF Flanged Design: The CF flanges allow for easy, secure installation, ensuring compatibility with a wide range of piping systems.
  • Manual Operation: This gate valve is manually operated, offering precise control over fluid flow in applications where automation is not required.

Applications:

  • Industrial Processing: Ideal for industries such as chemical processing, oil and gas, and water treatment, where durability and flow control are critical.
  • High-Temperature Systems: With its copper bonnet, this valve is well-suited for systems exposed to elevated temperatures.
  • General Fluid Control: Perfect for use in systems where precise manual regulation of flow is needed.

TFM sells CF Flanged SS Copper Bonnet Gate Valves, offering a reliable solution for industries that require manual flow control with enhanced durability.

Specifications Table

ManufacturerTFM
PressureTorr
Min: 7.501 x 10-11 Torr
Max: 760 Torrmbar
Min: 1.000 x 10-10 mbar
Max: 1013 mbar
RatesHelium Leak Rate
2.000 x 10-9 mbar*L/s
1.500 x 10-9 Torr*L/s
TemperatureActuator
60.0 ºC
140 ºFClosed Bake
150 ºC
302 ºFOpen Bake
200 ºC
392 ºF
Shaft Seal
Material
Bellows Sealed
Cycle
Life
100,000
Actuator
Type
Manual
Max Differential Pressure
Before Open
22.5  Torr
Bonnet
Seal Type
Copper
Valve Body
Material
Stainless Steel
Valve Seal
Material
Fluorocarbon (FKM)

Ordering Table

Drawing Flange Size Bonnet Seal Type Thread Note Part Number
Tooltip DN16CF (1.33" OD) Copper #8-32 1 SG0063MCCF
Tooltip DN16CF (1.33" OD) Copper M4 SG0063MCCFM
Tooltip DN35CF-DN40CF (2.75" OD) Copper 2001/4/28 SG0150MCCF
Tooltip DN35CF-DN40CF (2.75" OD) Copper M6 SG0150MCCFM
Tooltip DN50CF (3.38" OD) Copper 5/16-24 SG0200MCCF
Tooltip DN50CF (3.38" OD) Copper M8 SG0200MCCFM
Tooltip DN63CF (4.50" OD) Copper 5/16-24 SG0250MCCF
Tooltip DN63CF (4.50" OD) Copper M8 SG0250MCCFM
Tooltip DN75CF (4.63" OD) Copper 5/16-24 SG0300MCCF
Tooltip DN75CF (4.63" OD) Copper M8 SG0300MCCFM
Tooltip DN100CF (6.00" OD) Copper 5/16-24 SG0400MCCF
Tooltip DN100CF (6.00" OD) Copper M8 SG0400MCCFM
Tooltip DN160CF (8.00" OD) Copper 5/16-24 SG0600MCCF
Tooltip DN160CF (8.00" OD) Copper M8 SG0600MCCFM
Tooltip DN200CF (10.00" OD) Copper 5/16-24 SG0800MCCF
Tooltip DN200CF (10.00" OD) Copper M8 SG0800MCCFM
Tooltip DN250CF (12.00" OD) Copper 5/16-24 SG1000MCCF
Tooltip DN250CF (12.00" OD) Copper M8 SG1000MCCFM
Tooltip DN275CF (13.25" OD) Copper 2003/8/24 SG1075MCCF
Tooltip DN275CF (13.25" OD) Copper M10 SG1075MCCFM
Tooltip DN295CF (14.00" OD) Copper 2003/8/24 SG1200MCCF
Tooltip DN295CF (14.00" OD) Copper M10 SG1200MCCFM

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FAQ

Sputtering targets are materials used in thin-film deposition processes to create coatings on substrates. They are used in industries like semiconductors, optics, photovoltaics, and electronics.

Evaporation materials are used in Physical Vapor Deposition (PVD) processes, where materials are heated and evaporated to form a thin film on a substrate. These are critical for applications in optics, wear protection, and decorative coatings.

Boat crucibles are used as containers for evaporation materials during PVD processes. They help to uniformly evaporate materials onto the substrate for thin film formation.

Sputtering uses energetic particles to eject material from a target, while evaporation involves heating a material until it vaporizes and deposits on a substrate. Both are common methods in Physical Vapor Deposition (PVD) for creating thin films.

Consider the material composition, purity, target size, and application-specific requirements such as the thickness and uniformity of the film.

Yes, we offer customized sputtering targets, evaporation materials, and crucibles to meet specific customer requirements for size, material composition, and purity.

Yes, we can assist in selecting the most suitable material based on your application, whether it’s for optical coatings, semiconductor fabrication, or decorative finishes.

Yes, we offer both bulk and small quantities of sputtering targets, evaporation materials, and spherical powders to support research, prototyping, and development projects.

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