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V72H Series Rectangular Gate Valves (Heated)

Applications

  • Where heating is required, heated housing and blade heating is optional
  • Plasma Etch, CVD, Sputter Deposition
  • Manufacturing of solar panels
  • Semiconductor processing
  • LCD/flat panel processes

Key Features

  • Heated Gate or Heated Gate and Housing
    Designed to minimize particulate buildup by utilizing a heated gate or housing.
  • Semi-Standard Application
    Compatible with various industry standards including Semi E21-94, Semi E24-92, and Semi E21.1-1296.
  • Patented L-Motion Link and Dual Shifts
    This system, which operates without springs in the actuator, enables quicker and smoother movements, significantly reducing vibration.
  • Dust Seal on the Vacuum Side
    A dust seal located on the vacuum side of the bonnet flange helps prevent particulates from entering the bellows, ensuring cleaner operation.
  • Mechanical Locking Mechanism
    Once the gate reaches the end of its travel, the valve locks mechanically into place for secure operation.
  • Welded Bellows Actuator Seal
    The actuator seal features welded bellows, enhancing durability and leak prevention.
  • Bonnet Flange Bolts with Retainers
    The bolts on the bonnet flange are equipped with retainers, ensuring they don’t fall out during disassembly.

Available Options

  • Custom Sizes
    Tailored sizing options are available to meet specific application requirements.
  • Various O-Ring Compounds
    A selection of o-ring compounds, such as Kalrez® and Chemraz®, can be chosen based on compatibility needs.

Specifications Table

Temperature (°C)Valve body: Fluorocarbon 100°C (optional 180°C)
Valve actuator: Fluorocarbon 80°C (optional 100°C)
Pressure Range (torr)1 X 10-9 mbar – ATM
Differential Press (torr)≤ 1.2 bar in either direction
MaterialValve body, bonnet seal, gate: AL6061
Welded bellows: AM350
Valve actuator: Stainless Steel, aluminum
Seal MaterialFluorocarbon (option KALREZ, ETC)
Leak Rate (cc/sec)1 X 10-9 mbar. l/s
Cycles Until Service (approx.)≥ 2 million
Position IndicatorHoneywell: 11SM-244-T, JS-5
OperationDouble acting

Dimensional Drawings

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FAQ

Sputtering targets are materials used in thin-film deposition processes to create coatings on substrates. They are used in industries like semiconductors, optics, photovoltaics, and electronics.

Evaporation materials are used in Physical Vapor Deposition (PVD) processes, where materials are heated and evaporated to form a thin film on a substrate. These are critical for applications in optics, wear protection, and decorative coatings.

Boat crucibles are used as containers for evaporation materials during PVD processes. They help to uniformly evaporate materials onto the substrate for thin film formation.

Sputtering uses energetic particles to eject material from a target, while evaporation involves heating a material until it vaporizes and deposits on a substrate. Both are common methods in Physical Vapor Deposition (PVD) for creating thin films.

Consider the material composition, purity, target size, and application-specific requirements such as the thickness and uniformity of the film.

Yes, we offer customized sputtering targets, evaporation materials, and crucibles to meet specific customer requirements for size, material composition, and purity.

Yes, we can assist in selecting the most suitable material based on your application, whether it’s for optical coatings, semiconductor fabrication, or decorative finishes.

Yes, we offer both bulk and small quantities of sputtering targets, evaporation materials, and spherical powders to support research, prototyping, and development projects.

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