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ST0163B Lanthanum Strontium Manganate Sputtering Targets (La0.67Sr0.33MnO3)

MSDS File
Material TypeLanthanum Strontium Manganate
SymbolLa0.67Sr0.33MnO3, LSMO
Color/AppearanceVarious colors, Solid
Melting Point (°C)N/A
Relative Density (g/cc)6.5
Z RatioN/A
SputterRF, RF-R, DC
Max Power Density*
(Watts/Square Inch)		N/A
Type of BondIndium, Elastomer

Lanthanum Strontium Manganate Sputtering Targets (La₀.₇Sr₀.₃MnO₃)

Overview

Lanthanum Strontium Manganate (LSMO) sputtering targets are composed of a mixture of lanthanum, strontium, and manganese, offering unique properties ideal for various electronic applications. These targets are well-suited for use in applications requiring high-performance thin films such as ferroelectrics, gate dielectrics, and CMOS devices.

Lanthanum Strontium Manganate Sputtering Targets Information

  • Material Type: Lanthanum Strontium Manganate (LSMO)
  • Symbol: La₀.₇Sr₀.₃MnO₃
  • Color/Appearance: Solid, Various Colors
  • Relative Density: 6.5 g/cc
  • Sputtering Options: RF, RF-R, DC
  • Bonding Type: Indium, Elastomer

Applications of Lanthanum Strontium Manganate Sputtering Targets

  • Ferroelectric Materials
  • Gate Dielectrics
  • For CMOS Devices

Features

  • High Purity: Ensures consistent, high-quality thin films for advanced applications.
  • Custom Sizes Available: Targets can be customized to meet specific project requirements.

Manufacturing Process

  • Cold Pressing & Sintering: Manufactured using cold pressing and sintering techniques to ensure high density and stability.
  • Elastomer Bonding: Elastomer bonding to the backing plate enhances target integrity during sputtering.
  • Cleaning & Final Packaging: Targets are cleaned for vacuum use and packaged securely to protect from environmental contaminants during shipment.

Options Available

  • Purity: 99.9% minimum purity for superior performance.
  • Smaller Sizes for R&D: Custom sizes available for research and development applications.
  • Sputtering Target Bonding Service: Bonding services are available to improve target performance and stability.

For more information or inquiries, please contact us directly.

XRD Chart of Lanthanum Strontium Manganate Sputtering Targets

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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