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ST0163B Lanthanum Strontium Manganate Sputtering Targets (La0.67Sr0.33MnO3)

Introduction

Lanthanum Strontium Manganate sputtering targets, commonly referred to as LSMO (La₁₋ₓSrₓMnO₃), are widely used functional oxide materials in advanced thin-film deposition. Thanks to their unique combination of electrical conductivity, magnetic properties, and chemical stability, LSMO targets are essential for fabricating complex oxide thin films used in spintronics, magnetic devices, and oxide electronics research.

Detailed Description

Lanthanum Strontium Manganate is a perovskite-structured mixed-valence manganese oxide. Partial substitution of lanthanum by strontium precisely tunes the Mn³⁺/Mn⁴⁺ ratio, enabling controllable electrical and magnetic behavior. This tunability is one of the key reasons LSMO has become a benchmark material in correlated electron systems and oxide heterostructure studies.

Our Lanthanum Strontium Manganate sputtering targets are produced from high-purity raw materials using optimized solid-state reaction and sintering processes. The resulting targets exhibit high density, compositional uniformity, and stable sputtering behavior under RF or pulsed-DC conditions. Careful control of stoichiometry ensures reproducible film properties, which is critical for epitaxial growth and device-grade thin films.

LSMO targets are available in planar disc formats as well as customized shapes. Bonding options such as indium bonding or elastomer bonding to copper backing plates can be provided to improve thermal management and target integrity during high-power sputtering. These targets are compatible with a wide range of sputtering systems used in both research laboratories and pilot-scale production.

Applications

Lanthanum Strontium Manganate sputtering targets are primarily used in the deposition of functional oxide thin films for:

  • Spintronic devices and magnetic tunnel junctions

  • Oxide electronics and correlated electron systems

  • Electrodes for ferroelectric and multiferroic thin films

  • Magnetoresistive sensors and memory devices

  • Epitaxial oxide heterostructures grown by sputtering

  • Academic and industrial R&D on perovskite oxides

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical FormulaLa₁₋ₓSrₓMnO₃ (LSMO)Determines electrical & magnetic properties
Purity99.9% – 99.99%Reduces impurities affecting film performance
Sr Doping (x)0.1 – 0.4 (custom)Tunes conductivity and magnetism
Diameter1″ – 4″ (custom available)Fits standard sputtering cathodes
Thickness3 – 6 mmInfluences sputtering lifetime
Density≥ 95% of theoreticalEnsures stable sputtering rate
Backing PlateOptional Cu / AlImproves heat dissipation

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Lanthanum Strontium Manganate (LSMO)Conductive, ferromagnetic oxideSpintronics, oxide electronics
Lanthanum Manganate (LaMnO₃)Antiferromagnetic, insulatingFundamental oxide research
Strontium Ruthenate (SrRuO₃)Metallic oxide electrodeFerroelectric electrodes
Indium Tin Oxide (ITO)Transparent conductorDisplays, optoelectronics

FAQ

QuestionAnswer
Can the Sr doping level be customized?Yes, the La/Sr ratio can be tailored to application requirements.
Are these targets suitable for RF sputtering?Yes, they are compatible with RF and pulsed-DC sputtering.
Do you offer bonded targets?Yes, indium-bonded or elastomer-bonded options are available.
What density can be achieved?Typical density exceeds 95% of theoretical density.

Packaging

Our Lanthanum Strontium Manganate Sputtering Targets are individually labeled for traceability and quality assurance. Each target is vacuum-sealed and cushioned with protective materials to prevent contamination or mechanical damage during storage and transportation, ensuring they arrive ready for immediate installation.

Conclusion

Lanthanum Strontium Manganate sputtering targets provide a reliable and high-performance solution for depositing complex oxide thin films with well-defined electrical and magnetic properties. With controlled stoichiometry, high density, and flexible customization options, these targets are well suited for advanced research and specialized device fabrication.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

XRD Chart of Lanthanum Strontium Manganate Sputtering Targets

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La₀.₈₅Sr₀.₁₅MnO₃ (LSMO) target 99.9% Ø3"×3 mm, Bonded to 3 mm Cu BP, LSMO TRG La0.67Sr0.33MnO3, Ø1″×3.18 mm, Single Phase

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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