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VD0549A GeSbTe Pellet Evaporation Material

MSDS File
Material TypeGeSbTe
SymbolGeSbTe
Melting Point (°C)
Theoretical Density (g/cc)
Z Ratio
E-Beam
E-Beam Crucible Liner Material
Temp. (°C) for Given Vap. Press. (Torr)
Comments

GeSbTe Pellet Evaporation Material

TFM offers high-purity GeSbTe Pellet Evaporation Material, a key material for thin-film deposition in phase-change memory (PCM) devices, optical recording, and semiconductor applications. Composed of germanium (Ge), antimony (Sb), and tellurium (Te), this material features unique phase-change properties that enable reversible transitions between amorphous and crystalline states, making it ideal for use in data storage technologies and optical devices.

Designed for thermal evaporation and electron beam (E-beam) evaporation, GeSbTe Pellet Evaporation Material ensures uniform deposition, high film purity, and excellent adhesion. This material is well-suited for the development of high-performance memory devices, photonic systems, and optical storage media.

Key Features and Advantages

  • Reversible Phase-Change Properties: Ideal for phase-change memory (PCM) and optical recording applications where the material can switch between amorphous and crystalline states for reliable data storage and retrieval.

  • High Purity & Excellent Film Uniformity: Ensures consistent deposition, reducing defects and improving device reliability.

  • Fast Switching Speed: Facilitates fast data storage and retrieval in optical and memory devices, providing enhanced performance for non-volatile memory systems.

  • Superior Adhesion & Smooth Coatings: Guarantees strong film adhesion and smooth surface coatings for high-quality device performance.

  • Custom Compositions Available: Tailored to meet specific needs for research, development, and industrial applications.

Applications

  • Phase-Change Memory (PCM): Used in next-generation non-volatile memory devices, offering fast read/write speeds and high-density storage.

  • Optical Data Storage: Ideal for optical recording applications such as CDs, DVDs, Blu-ray, and rewritable optical disks.

  • Semiconductor & Photonic Devices: Plays a critical role in photonic systems, laser technologies, and advanced semiconductor research.

  • Thin-Film Coatings for Optical Systems: Essential for optical coatings used in data storage systems and high-tech optical devices.

Industry Impact and Customization

TFM’s GeSbTe Pellet Evaporation Material supports the development of high-performance data storage and optical recording systems. With precise composition control, high purity, and uniform deposition, TFM provides material solutions that enable the advancement of phase-change memory technology and next-generation optical storage.

With its unique phase-change properties, superior film quality, and exceptional performance, TFM’s GeSbTe Pellet Evaporation Material is a crucial component for innovative memory devices, optical data storage technologies, and advanced semiconductor applications, ensuring outstanding efficiency, long-term reliability, and consistent high performance.

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GeSbTe evaporation material 1/1/1 at% 99.9% 1–8 mm pieces

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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