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Niobium (Nb) Rotary Sputtering Target

Introduction

TFM offers high-quality Niobium Nb rotary sputtering targets, designed for thin-film deposition in a variety of advanced applications, including semiconductors, coatings, and electronic devices. Niobium Nb targets are known for their exceptional chemical resistance, high melting point, and superior thermal conductivity, making them ideal for use in extreme environments.

The rotary sputtering target design ensures uniform and efficient deposition of Niobium Nb films, which are commonly used in superconducting materials, optical coatings, and high-performance capacitors. Niobium Nb films offer excellent oxidation resistance and corrosion resistance, making them highly suited for aerospace, nuclear, and high-temperature applications.

Niobium Nb films are frequently used in superconducting thin films, thin-film transistors (TFTs), and thin-film capacitors. Niobium nitride (NbN) films are highly sought after in the field of superconductivity due to their ability to exhibit zero electrical resistance at low temperatures, making them critical for quantum computing and high-frequency applications. Additionally, Niobium Nb films are utilized in decorative coatings and chemical vapor deposition (CVD) processes due to their unique appearance and long-term stability.

TFM provides customized Niobium Nb rotary sputtering targets, ensuring precise control over material composition and purity to meet the requirements of high-performance applications. These targets deliver consistent and reliable deposition results in industries such as electronics, energy storage, aerospace, and medical devices.

Our Niobium Nb rotary sputtering targets are manufactured to the highest standards, ensuring superior material quality and consistent sputtering performance. With low impurity levels, high density, and optimized sputtering characteristics, TFM’s Niobium Nb targets are ideal for high-quality thin-film deposition for next-generation technologies.

Specifications

MaterialsNiobium Rotary Sputtering Target
SymbolNb
Purity99.95%
Theoretical Density (g/cc)8.57
Melting Point (°C)2,468
Production MethodSpraying Type / Monolithic Type (VIM)
Backing TubeTitanium, Stainless Steel
SizeAs per customer’s drawings
Relative Density>= 96%
Grain Sizes< 100 µm
Annual Capacity1000 tons

Applications

  • Optical Coating
  • Semiconductor Electronics Industry
  • TFT-LCD Coating
  • Construction / Automotive Glass Industry

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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