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Lanthanum Aluminate Substrate (LaAlO3)

Lanthanum Aluminate Substrate (LaAlO3)

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Lanthanum Aluminate Substrate (LaAlO₃)

Lanthanum Aluminate (LaAlO₃) is a high-performance single crystal substrate widely used in industrial applications and the production of high-temperature superconducting thin films. Manufactured using the Czochralski growth method, it offers large single crystals up to 2 inches in diameter or larger. Its compatibility with YBaCuO high-temperature superconducting thin films, along with its low dielectric constant and minimal microwave loss, makes it essential for advanced microwave electronic devices.

Key Physical Properties

PropertyValue
MaterialLaAlO₃
Crystal SystemHexagonal (at room temperature); Cubic (>435℃)
Lattice (Å)Hexagonal a=5.3575, c=13.22; Cubic a=3.821
Growth MethodCzochralski
Hardness6-6.5 (Mohs)
Melting Point2080℃
Density6.52 g/cm³
Thermal Expansion9.4 (x 10⁻⁶/℃)
Permittivityε = 21
Loss Tangent (10 GHz)~ 3 × 10⁻⁴ @ 300 K, ~ 0.6 × 10⁻⁴ @ 77 K
Color and AppearanceBrown-yellow to brown polished with natural twinned domains (based on annealing conditions)
Chemical StabilityInsoluble in mineral acid at room temperature; soluble in H₃PO₄ at temperatures above 150℃
Key FeatureIdeal for microwave electronics

Specifications

  • Size: 10×3 mm, 10×5 mm, 10×10 mm, 15×15 mm, 20×20 mm, Dia 15 mm, Dia 20 mm, Dia 1”, Dia 2”, Dia 2.6”
  • Thickness: 0.5 mm, 1.0 mm
  • Polishing: SSP or DSP
  • Orientation: <100>, <110>, <111>
  • Redirection Precision: ±0.5°
  • Edge Redirection: 2° (special 1° available)
  • Angle of Crystalline: Custom sizes and orientations available
  • Surface Roughness (Ra): ≤5Å (5µm × 5µm)

Packaging Details

TFM ensures that Lanthanum Aluminate substrates are packaged in class 100 clean bags or wafer containers within a class 1000 clean room to maintain product integrity and quality.

Explore premium-quality Lanthanum Aluminate Substrates (LaAlO₃) from TFM for cutting-edge industrial and electronic applications.

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FAQ

A thin film substrate is the base material upon which thin layers of materials are deposited to create electronic, optical, or mechanical devices. The substrate provides structural support and can influence the properties of the thin film.

The choice of substrate affects the film’s structural integrity, electrical properties, and overall performance. Factors like thermal expansion coefficient, surface smoothness, and chemical compatibility are crucial considerations.

Materials such as lanthanum aluminate (LaAlO₃), magnesium oxide (MgO), and strontium titanate (SrTiO₃) are commonly used due to their lattice compatibility and thermal stability, which are essential for optimal superconducting properties.

Metal substrates offer high electrical and thermal conductivity, making them suitable for applications requiring efficient heat dissipation and electrical connectivity. However, their surface properties and potential for oxidation must be managed during deposition.

These substrates are materials that can support the growth of thin films exhibiting magnetic or ferroelectric properties, essential for applications in memory devices, sensors, and actuators.

Semiconductor substrates, such as silicon wafers, serve as the foundation for integrated circuits and various electronic components, providing the necessary electrical characteristics and structural support for device fabrication.

Gallium Nitride (GaN) substrates are pivotal for high-performance optoelectronic and power devices due to their excellent thermal conductivity, high breakdown voltage, and efficiency. They are widely used in LEDs, power transistors, and RF components.

Halide crystal substrates, composed of halide compounds, are utilized in specialized optical applications, including infrared spectroscopy and laser systems, due to their unique optical properties.
Ceramic substrates provide high thermal stability, mechanical strength, and electrical insulation, making them ideal for high-frequency and high-power applications.
Proper surface preparation, including cleaning and polishing, ensures the removal of contaminants and surface irregularities, leading to improved film adhesion, uniformity, and performance.
Yes, thin films can be deposited on flexible substrates like polymers, enabling the development of flexible electronics and wearable devices. However, challenges include managing mechanical stress and ensuring film adhesion.
Challenges include ensuring lattice matching to minimize defects, managing thermal expansion differences to prevent stress and delamination, and achieving desired electrical and optical properties for specific applications.
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