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Strontium Lanthanum Aluminate Substrate (LaSrAlO4)

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Strontium Lanthanum Aluminate Substrate (LaSrAlO₄)

TFM offers high-quality Strontium Lanthanum Aluminate (LaSrAlO₄) substrates, known for their excellent chemical stability, high dielectric constant, and superior lattice matching with various oxide materials. These substrates are ideal for epitaxial growth of thin films, particularly in optoelectronics, superconductivity, and high-frequency applications.

LaSrAlO₄ substrates exhibit exceptional thermal stability and low thermal expansion, making them suitable for high-performance electronic devices and quantum material research. Their high refractive index and transparency in the visible and infrared ranges make them useful in optical coatings and photonics. Additionally, LaSrAlO₄ substrates are often used in complex oxide systems where high-quality interface formation is crucial.

TFM supplies customized LaSrAlO₄ substrates, offering precise specifications for a wide range of applications, from electronic devices to advanced material research, ensuring optimal performance and reliability.

Key Physical Properties

PropertyValue
MaterialLaSrAlO₄ (Strontium Lanthanum Aluminate)
StructureM4
Lattice (A)a=3.756, c=12.63
Growth MethodCzochralski
Melting Point1650℃
Density5.92 g/cm³
Hardness6-6.5 (Mohns)
Permittivityε = 16.8

Specifications

  • Size: 10×3 mm, 10×5 mm, 10×10 mm, 15×15 mm, 20×20 mm, Dia 15 mm, Dia 20 mm, Dia 1”, Dia 2”
  • Thickness: 0.5 mm, 1.0 mm
  • Polishing: SSP or DSP
  • Orientation: <001>
  • Redirection Precision: ±0.5°
  • Angle of Crystalline: Custom sizes and orientations available
  • Surface Roughness (Ra): ≤5Å (5µm × 5µm)

Packaging Details

Strontium Lanthanum Aluminate substrates are securely packaged in class 100 clean bags or wafer containers in a class 1000 clean room, ensuring optimal cleanliness and protection.

Choose Strontium Lanthanum Aluminate Substrates from TFM for high-quality thin films and reliable performance in advanced semiconductor applications.

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FAQ

A thin film substrate is the base material upon which thin layers of materials are deposited to create electronic, optical, or mechanical devices. The substrate provides structural support and can influence the properties of the thin film.

The choice of substrate affects the film’s structural integrity, electrical properties, and overall performance. Factors like thermal expansion coefficient, surface smoothness, and chemical compatibility are crucial considerations.

Materials such as lanthanum aluminate (LaAlO₃), magnesium oxide (MgO), and strontium titanate (SrTiO₃) are commonly used due to their lattice compatibility and thermal stability, which are essential for optimal superconducting properties.

Metal substrates offer high electrical and thermal conductivity, making them suitable for applications requiring efficient heat dissipation and electrical connectivity. However, their surface properties and potential for oxidation must be managed during deposition.

These substrates are materials that can support the growth of thin films exhibiting magnetic or ferroelectric properties, essential for applications in memory devices, sensors, and actuators.

Semiconductor substrates, such as silicon wafers, serve as the foundation for integrated circuits and various electronic components, providing the necessary electrical characteristics and structural support for device fabrication.

Gallium Nitride (GaN) substrates are pivotal for high-performance optoelectronic and power devices due to their excellent thermal conductivity, high breakdown voltage, and efficiency. They are widely used in LEDs, power transistors, and RF components.

Halide crystal substrates, composed of halide compounds, are utilized in specialized optical applications, including infrared spectroscopy and laser systems, due to their unique optical properties.
Ceramic substrates provide high thermal stability, mechanical strength, and electrical insulation, making them ideal for high-frequency and high-power applications.
Proper surface preparation, including cleaning and polishing, ensures the removal of contaminants and surface irregularities, leading to improved film adhesion, uniformity, and performance.
Yes, thin films can be deposited on flexible substrates like polymers, enabling the development of flexible electronics and wearable devices. However, challenges include managing mechanical stress and ensuring film adhesion.
Challenges include ensuring lattice matching to minimize defects, managing thermal expansion differences to prevent stress and delamination, and achieving desired electrical and optical properties for specific applications.
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