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Niobium Doped Strontium Titanate Substrate

Niobium Doped Strontium Titanate Substrate (Nb: SrTiO3)

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Niobium Doped Strontium Titanate Substrate

TFM offers high-quality Niobium-doped Strontium Titanate (Nb:SrTiO₃) substrates, renowned for their excellent electrical conductivity, high dielectric constant, and superior lattice matching with complex oxide materials. These substrates are widely used in oxide electronics, superconducting thin films, and high-frequency device applications.

With tunable electrical conductivity controlled by Nb doping levels, Nb:SrTiO₃ serves as an ideal substrate for perovskite oxide heterostructures, transparent conductive electrodes, and two-dimensional electron gas (2DEG) studies. Its low lattice mismatch with functional oxides ensures high-quality epitaxial growth, making it a preferred choice for research and device fabrication in quantum materials, resistive switching devices, and optical applications.

TFM supplies customized Nb:SrTiO₃ substrates with precise doping concentrations and orientations, meeting the rigorous demands of advanced materials research and next-generation electronic technologies.

Physical Properties of Niobium Doped Strontium Titanate Substrate

PropertyDetails
MaterialNb: SrTiO3
Nb Concentration10%, 7%, 0.5%, 0.1%
Resistivity (Ω·cm)0.0035, 0.007, 0.05, 0.08
Migration Rates (cm²/Vs)98.5, 8.5, 6.5

Specifications of Niobium Doped Strontium Titanate Substrate

  • Size: 10×3, 10×5, 10×10, 15×15, 20×15, 20×20, Dia 15, Dia 20, Dia 1”
  • Thickness: 0.5 mm, 1.0 mm
  • Polished: SSP or DSP
  • Orientation: <100>, <110>, <111>
  • Redirection Precision: ±0.5°
  • Redirection Edge: 2° (special at 1° available)
  • Angle of Crystalline: Special sizes and orientations available upon request
  • Surface Roughness (Ra): ≤5Å (5µm × 5µm)

Packaging of Niobium Doped Strontium Titanate Substrate

The substrates are securely packaged in class 100 clean bags or wafer containers within a class 1000 clean room environment to ensure their quality and cleanliness.

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FAQ

A thin film substrate is the base material upon which thin layers of materials are deposited to create electronic, optical, or mechanical devices. The substrate provides structural support and can influence the properties of the thin film.

The choice of substrate affects the film’s structural integrity, electrical properties, and overall performance. Factors like thermal expansion coefficient, surface smoothness, and chemical compatibility are crucial considerations.

Materials such as lanthanum aluminate (LaAlO₃), magnesium oxide (MgO), and strontium titanate (SrTiO₃) are commonly used due to their lattice compatibility and thermal stability, which are essential for optimal superconducting properties.

Metal substrates offer high electrical and thermal conductivity, making them suitable for applications requiring efficient heat dissipation and electrical connectivity. However, their surface properties and potential for oxidation must be managed during deposition.

These substrates are materials that can support the growth of thin films exhibiting magnetic or ferroelectric properties, essential for applications in memory devices, sensors, and actuators.

Semiconductor substrates, such as silicon wafers, serve as the foundation for integrated circuits and various electronic components, providing the necessary electrical characteristics and structural support for device fabrication.

Gallium Nitride (GaN) substrates are pivotal for high-performance optoelectronic and power devices due to their excellent thermal conductivity, high breakdown voltage, and efficiency. They are widely used in LEDs, power transistors, and RF components.

Halide crystal substrates, composed of halide compounds, are utilized in specialized optical applications, including infrared spectroscopy and laser systems, due to their unique optical properties.
Ceramic substrates provide high thermal stability, mechanical strength, and electrical insulation, making them ideal for high-frequency and high-power applications.
Proper surface preparation, including cleaning and polishing, ensures the removal of contaminants and surface irregularities, leading to improved film adhesion, uniformity, and performance.
Yes, thin films can be deposited on flexible substrates like polymers, enabling the development of flexible electronics and wearable devices. However, challenges include managing mechanical stress and ensuring film adhesion.
Challenges include ensuring lattice matching to minimize defects, managing thermal expansion differences to prevent stress and delamination, and achieving desired electrical and optical properties for specific applications.
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