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Rutile Substrate (TiO2)

Rutile Substrate (TiO2)

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Rutile Substrate (TiO2)

TFM offers high-quality Rutile (TiO₂) substrates, known for their excellent optical, dielectric, and structural properties. These substrates are widely used in thin-film epitaxy, optoelectronic devices, and photonic applications, thanks to their high refractive index, superior transparency, and excellent lattice matching with various functional materials.

Rutile TiO₂ substrates are ideal for oxide thin-film growth, including ferroelectric, multiferroic, and superconducting materials. Their low absorption in the visible and infrared range makes them suitable for optical coatings, waveguides, and high-performance photonic devices. Additionally, the high dielectric constant and thermal stability of TiO₂ support applications in high-frequency and power electronic devices.

TFM supplies precisely engineered Rutile TiO₂ substrates in various orientations and sizes, ensuring optimal performance for advanced material research and next-generation electronic and optical technologies.

Physical Properties

  • Material: Rutile (TiO2)
  • Crystal Structure: M4
  • Lattice Constants:
    • a = 4.5936 Å
    • c = 2.9582 Å
  • Growth Method: Vernuil method, Float zone method
  • Hardness: 7.0 on the Mohs scale
  • Density: 4.26 g/cm³
  • Melting Point: 1870°C
  • Dielectric Constants:
    • dη/dT: a = -0.72 × 10⁻⁶/K, c = -0.42 × 10⁻⁶/K
  • Linear Expansion Coefficients:
    • 7.14 × 10⁻⁶/°C along the a-axis
    • 9.19 × 10⁻⁶/°C along the c-axis

Specifications

  • Size Options:
    • 5×5×10mm
    • 5×10×10mm
    • 10×10×0.5mm
    • Custom sizes available upon request
  • Polished: SSP or DSP

Packaging

Rutile Substrates are carefully packaged in class 100 clean bags or wafer containers, all within a class 1000 clean room, ensuring protection during handling and transport.

Ideal for optical devices requiring high precision, Rutile Substrates provide an excellent solution for high-performance applications.

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FAQ

A thin film substrate is the base material upon which thin layers of materials are deposited to create electronic, optical, or mechanical devices. The substrate provides structural support and can influence the properties of the thin film.

The choice of substrate affects the film’s structural integrity, electrical properties, and overall performance. Factors like thermal expansion coefficient, surface smoothness, and chemical compatibility are crucial considerations.

Materials such as lanthanum aluminate (LaAlO₃), magnesium oxide (MgO), and strontium titanate (SrTiO₃) are commonly used due to their lattice compatibility and thermal stability, which are essential for optimal superconducting properties.

Metal substrates offer high electrical and thermal conductivity, making them suitable for applications requiring efficient heat dissipation and electrical connectivity. However, their surface properties and potential for oxidation must be managed during deposition.

These substrates are materials that can support the growth of thin films exhibiting magnetic or ferroelectric properties, essential for applications in memory devices, sensors, and actuators.

Semiconductor substrates, such as silicon wafers, serve as the foundation for integrated circuits and various electronic components, providing the necessary electrical characteristics and structural support for device fabrication.

Gallium Nitride (GaN) substrates are pivotal for high-performance optoelectronic and power devices due to their excellent thermal conductivity, high breakdown voltage, and efficiency. They are widely used in LEDs, power transistors, and RF components.

Halide crystal substrates, composed of halide compounds, are utilized in specialized optical applications, including infrared spectroscopy and laser systems, due to their unique optical properties.
Ceramic substrates provide high thermal stability, mechanical strength, and electrical insulation, making them ideal for high-frequency and high-power applications.
Proper surface preparation, including cleaning and polishing, ensures the removal of contaminants and surface irregularities, leading to improved film adhesion, uniformity, and performance.
Yes, thin films can be deposited on flexible substrates like polymers, enabling the development of flexible electronics and wearable devices. However, challenges include managing mechanical stress and ensuring film adhesion.
Challenges include ensuring lattice matching to minimize defects, managing thermal expansion differences to prevent stress and delamination, and achieving desired electrical and optical properties for specific applications.
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