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Polysilicon (Multicrystalline) Wafer

Polysilicon (Multicrystalline) Wafer

Polysilicon (Multicrystalline) wafers are essential materials for the production of photovoltaic cells, playing a crucial role in various industries. These wafers are widely used in photovoltaic power generation, communications, transportation, and residential power supply, especially in remote areas. They also find applications in emerging fields such as solar lighting, lawn solar power, and rooftop solar energy systems.

The Polysilicon (Multicrystalline) wafers produced by TFM are known for their superior surface quality and high conversion efficiency, ensuring optimal performance and reliability in a range of applications.

Specifications

MaterialsPolysilicon (Multicrystalline) Wafer
SymbolSi
ProcessDiamond wire cutting
Conduction type/ DopantP-type or N-type
Side width156.75.00~157.25mm
Thickness200±20μm
Conversion efficiency>18.8%

Technical Data

Material Characters
Crystal Growth MethodDSS–
Conduction type/ DopantP/Boron, GalliumConductivity type tester
Resistivity (Ω·cm)0.8～3.5Non-contact testing
Lifetime of brick (μs)≥4 μsSemilab WT-2000D
Textured Surface  Reflectivity17.5% ± 2.5%Standard Diffusion 8 Integration Spheree  Spectroscopic-Reflectometer
Oxygen Concentration
(atoms/cm3)		≤5.0E17 （10ppma）FTIR(ASTM F1188)
Carbon Concentration
(atoms/cm3)		≤5.0E17 （10ppma）FTIR(ASTM F1391)

Properties

Dimension
Side Length156.75/157.25±0.25 mmDigital vernier caliper or wafer inspection system
Thickness170-200 μmWafer inspection system
TTV≤30 μmWafer inspection system
Saw mark≤15 μmWafer inspection system
Warpage≤50 μmWafer inspection system
Verticality of side90 o±0.3oWafer inspection system (CCD)
Chamfer Hypotenuse0.45~ 2.00 mmVernierCaliper /CCD
Chamfer Cathetus0.31~ 1.42 mm
Chamfer angle45 o±10o

Description

Packing

200 pcs/foam box → 10 foam Boxes/ Carton→ 24 Cantoms/ Wooden Pallet

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FAQ

A thin film substrate is the base material upon which thin layers of materials are deposited to create electronic, optical, or mechanical devices. The substrate provides structural support and can influence the properties of the thin film.

The choice of substrate affects the film’s structural integrity, electrical properties, and overall performance. Factors like thermal expansion coefficient, surface smoothness, and chemical compatibility are crucial considerations.

Materials such as lanthanum aluminate (LaAlO₃), magnesium oxide (MgO), and strontium titanate (SrTiO₃) are commonly used due to their lattice compatibility and thermal stability, which are essential for optimal superconducting properties.

Metal substrates offer high electrical and thermal conductivity, making them suitable for applications requiring efficient heat dissipation and electrical connectivity. However, their surface properties and potential for oxidation must be managed during deposition.

These substrates are materials that can support the growth of thin films exhibiting magnetic or ferroelectric properties, essential for applications in memory devices, sensors, and actuators.

Semiconductor substrates, such as silicon wafers, serve as the foundation for integrated circuits and various electronic components, providing the necessary electrical characteristics and structural support for device fabrication.

Gallium Nitride (GaN) substrates are pivotal for high-performance optoelectronic and power devices due to their excellent thermal conductivity, high breakdown voltage, and efficiency. They are widely used in LEDs, power transistors, and RF components.

Halide crystal substrates, composed of halide compounds, are utilized in specialized optical applications, including infrared spectroscopy and laser systems, due to their unique optical properties.
Ceramic substrates provide high thermal stability, mechanical strength, and electrical insulation, making them ideal for high-frequency and high-power applications.
Proper surface preparation, including cleaning and polishing, ensures the removal of contaminants and surface irregularities, leading to improved film adhesion, uniformity, and performance.
Yes, thin films can be deposited on flexible substrates like polymers, enabling the development of flexible electronics and wearable devices. However, challenges include managing mechanical stress and ensuring film adhesion.
Challenges include ensuring lattice matching to minimize defects, managing thermal expansion differences to prevent stress and delamination, and achieving desired electrical and optical properties for specific applications.
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