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Magnesium Aluminate Substrate

Magnesium Aluminate Substrate (MgAl6O10)

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TFM Magnesium Aluminate (MgAl₆O₁₀) Substrate

Magnesium Aluminate (MgAl₆O₁₀) substrates are advanced ceramic materials known for their excellent thermal stability, high mechanical strength, and superior electrical insulation properties. These substrates exhibit exceptional resistance to high temperatures and harsh chemical environments, making them ideal for demanding applications in electronics, optics, and high-frequency devices.

MgAl₆O₁₀ substrates offer a smooth and highly polished surface, ensuring optimal thin-film deposition for semiconductor and optical coatings. Their low thermal expansion coefficient enhances reliability in high-temperature environments, reducing thermal stress and improving longevity. These substrates are widely used in microelectronics, laser components, and high-power device fabrication due to their excellent dielectric properties and minimal signal loss.

With outstanding mechanical and chemical durability, Magnesium Aluminate substrates provide a reliable foundation for cutting-edge technologies, supporting innovations in aerospace, telecommunications, and advanced sensor systems.

Magnesium Aluminate Substrate Physical Properties

PropertyDetails
MaterialMgAl₆O₁₀
Crystal StructureM3
Lattice Constant (Å)a = 7.9780
Density (g/cm³)3.585 g/cm³
Thermal Expansivitya = 6.5 x 10⁻⁶ /°C, c = 3.7 x 10⁻⁶ /°C

Magnesium Aluminate Substrate Specifications

SpecificationDetails
Size5×5 mm, 10×10 mm, 15×15 mm, 20×20 mm, Dia 2″ (maximum size)
Crystal Orientation＜100＞, ＜110＞, ＜111＞
PolishedSSP or DSP
Redirection Precision±0.5°
Angle of CrystallineSpecial sizes and orientations available upon request
Surface Roughness (Ra)≤ 5 Å (5 μm × 5 μm)

Magnesium Aluminate Substrate Packaging

TFM ensures that all Magnesium Aluminate substrates are carefully packaged in a class 100 clean bag or wafer container within a class 1000 clean room, protecting the material during transport.

Opt for TFM’s Magnesium Aluminate substrates for your high-performance applications, offering excellent material properties for GaN and ZnO epitaxial growth.

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FAQ

A thin film substrate is the base material upon which thin layers of materials are deposited to create electronic, optical, or mechanical devices. The substrate provides structural support and can influence the properties of the thin film.

The choice of substrate affects the film’s structural integrity, electrical properties, and overall performance. Factors like thermal expansion coefficient, surface smoothness, and chemical compatibility are crucial considerations.

Materials such as lanthanum aluminate (LaAlO₃), magnesium oxide (MgO), and strontium titanate (SrTiO₃) are commonly used due to their lattice compatibility and thermal stability, which are essential for optimal superconducting properties.

Metal substrates offer high electrical and thermal conductivity, making them suitable for applications requiring efficient heat dissipation and electrical connectivity. However, their surface properties and potential for oxidation must be managed during deposition.

These substrates are materials that can support the growth of thin films exhibiting magnetic or ferroelectric properties, essential for applications in memory devices, sensors, and actuators.

Semiconductor substrates, such as silicon wafers, serve as the foundation for integrated circuits and various electronic components, providing the necessary electrical characteristics and structural support for device fabrication.

Gallium Nitride (GaN) substrates are pivotal for high-performance optoelectronic and power devices due to their excellent thermal conductivity, high breakdown voltage, and efficiency. They are widely used in LEDs, power transistors, and RF components.

Halide crystal substrates, composed of halide compounds, are utilized in specialized optical applications, including infrared spectroscopy and laser systems, due to their unique optical properties.
Ceramic substrates provide high thermal stability, mechanical strength, and electrical insulation, making them ideal for high-frequency and high-power applications.
Proper surface preparation, including cleaning and polishing, ensures the removal of contaminants and surface irregularities, leading to improved film adhesion, uniformity, and performance.
Yes, thin films can be deposited on flexible substrates like polymers, enabling the development of flexible electronics and wearable devices. However, challenges include managing mechanical stress and ensuring film adhesion.
Challenges include ensuring lattice matching to minimize defects, managing thermal expansion differences to prevent stress and delamination, and achieving desired electrical and optical properties for specific applications.
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