Ceramic Substrates

Ceramic Substrates for Thin Film, Microelectronic, and High-Temperature Applications

ThinFilmMaterials offers a wide range of high-performance Ceramic Substrates engineered for use in vacuum deposition, semiconductor processing, electronic packaging, and optical applications. These substrates provide excellent electrical insulation, thermal stability, and dimensional precision under extreme conditions.

Our Ceramic Substrates are available in a variety of materials, including alumina (Al₂O₃), aluminum nitride (AlN), zirconia (ZrO₂), silicon nitride (Si₃N₄), and quartz. Each material is selected based on its dielectric properties, thermal conductivity, and compatibility with specific deposition or circuit integration processes.

Key Features of Ceramic Substrates:

• Materials: Alumina, Aluminum Nitride, Zirconia, Quartz, Silicon Nitride

• Surface finish: Lapped, polished, or as-fired

• Thicknesses: From 0.25 mm to 5 mm (custom options available)

• Tolerance: Tight dimensional control for mask alignment and precision patterning

• Properties: High thermal resistance, excellent dielectric strength, corrosion resistance

Applications:

Ceramic Substrates are widely used in:

• Sputtering and evaporation deposition platforms

• Microelectronics and hybrid circuit packaging

• Laser diode mounting and RF components

• Insulating spacers in vacuum or high-voltage systems

• Optical windows and sensors in harsh environments

At ThinFilmMaterials, we provide Ceramic Substrates in standard wafer sizes (1″–6″) as well as custom-machined dimensions. Substrates can be supplied polished on one or both sides, with optional metallization or laser patterning services upon request.