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LiNi₀.₅Mn₁.₅O₄ Sputtering Target

ST0163S LiNi₀.₅Mn₁.₅O₄ Sputtering Target

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LiNi₀.₅Mn₁.₅O₄ Sputtering Target Description

TFM supplies high-purity LiNi₀.₅Mn₁.₅O₄ sputtering targets, designed for use in advanced thin film deposition applications, particularly in the fields of energy storage, battery research, and solid-state thin-film lithium-ion batteries.

LiNi₀.₅Mn₁.₅O₄ (also abbreviated as LNMO) is a spinel-structured lithium nickel manganese oxide material known for its high-voltage operation (~4.7 V vs. Li/Li⁺), excellent thermal stability, and favorable rate capability. These characteristics make it an ideal cathode material for next-generation lithium-ion batteries and solid-state microbatteries.

When used as a sputtering target, LNMO enables the deposition of thin, uniform cathode films with good stoichiometric control and electrochemical performance. It is particularly suitable for fabrication by magnetron sputtering or pulsed laser deposition (PLD) in battery R&D.

LiNi₀.₅Mn₁.₅O₄ Sputtering Target Specification

PropertyValue
Chemical FormulaLiNi₀.₅Mn₁.₅O₄
Crystal StructureSpinel
AppearanceBlack or dark brown ceramic
Purity≥ 99.9% (3N)
Density~4.3 g/cm³
Melting PointDecomposes before melting
Available SizesDia.: 1″, 2″, 3″, 4″
Thick: 0.125″, 0.250″ (custom sizes available)
FormSintered ceramic disk or bonded target

LiNi₀.₅Mn₁.₅O₄ Sputtering Target Handling Notes

  1. Bonding is strongly recommended for LNMO sputtering targets due to their brittle nature and ceramic microstructure.

  2. Avoid thermal shock during sputtering; ramp temperature gradually to reduce stress on the target.

  3. Ensure clean handling and storage in a dry, inert environment to preserve material integrity.

LiNi₀.₅Mn₁.₅O₄ Sputtering Target Packaging

TFM ensures all LiNi₀.₅Mn₁.₅O₄ sputtering targets are vacuum-sealed or packed in inert conditions with protective foam or hard casing. Labels include material identification, batch number, and purity, ensuring traceability and quality assurance throughout the supply chain.

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TFM offers LiNi₀.₅Mn₁.₅O₄ sputtering targets in standard and custom sizes, with high density and purity levels for consistent thin film deposition. Whether for battery R&D, energy storage films, or microfabrication, our LNMO targets deliver reliable performance.
Contact us for pricing, custom specifications, and bonding options.

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LiNi₀.₅Mn₁.₅O₄ ø101.6*3mm Indium Bonded 2.54mm Cu B/Plate w/ Keeper

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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