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WNiB Sputtering Target Made by TFM

Tungsten Nickel Boride Sputtering Target, WNiB

Tungsten Nickel Boride (WNiB) Sputtering Target

Chemical Formula: W/Ni/B
Catalog Number: TFM-SPT-0639

Specify the W:Ni:B ratio and wt% or at% basis, purity basis, finished target geometry, cathode and backing requirements, and film acceptance checks. Composition, dimensions, assembly and documentation require quotation and approved specification.

Product Overview

Tungsten Nickel Boride Sputtering Target (WNiB) is a compound sputtering target used to deposit thin films where a specific pre-compounded chemistry is required. These materials can behave differently from conductive metallic targets in terms of electrical response, thermal shock resistance, density sensitivity, and cracking risk, so target dimensions, density, backing design, and sputtering mode should be considered together.

Explore related materials in the Sputtering Targets catalog.

Related technical guide: WNiB and WZrB sputtering targets.


WNiB Sputtering Target Made by TFM
WNiB Sputtering Target Made by TFM

Material and Deposition Characteristics

The appropriate sputtering mode depends on target conductivity, thermal behavior, and the power-supply configuration. Many compound ceramic targets are evaluated first with RF magnetron sputtering, especially when electrical resistivity is high. For brittle or low-thermal-conductivity materials, density, backing support, and stable cooling are important for reliable operation.

Technical Data

SpecificationDetails
Material TypeTungsten Nickel Boride
Chemical SymbolW/Ni/B
Color/AppearanceMetallic gray, solid
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″; Thick: 0.125″, 0.250″ (Custom available)
Standard Purity99.7% (Higher purities up to 99.999% on request)
PackagingIndividually tagged, vacuum-sealed with protective casing

Typical Thin-Film Applications

  • Compound thin films for semiconductor, optical, protective, hard-coating, and functional-material research
  • Applications where a pre-compounded target is preferred over co-sputtering separate elemental targets
  • Projects requiring controlled chemistry and tailored target geometry for PVD development

Target Configuration and Ordering Considerations

For a WNiB quotation, specify whether the W/Ni/B chemistry is fixed or custom, the target dimensions, purity or composition basis, quantity, and the cathode model if known. Because this is a pre-compounded target, include the backing-plate or bonded-assembly requirement, cooling and operating-power information, and any density, tolerance, or inspection-document requirements. TFM can review drawings, old-target photos, and application details for custom dimensions.

Frequently Asked Questions

What is the main reason to use a Tungsten Nickel Boride sputtering target?

It provides a composition-specific source for depositing thin films when the required chemistry is better introduced from a pre-compounded target than from co-sputtering separate elements.

How should the sputtering mode for Tungsten Nickel Boride be selected?

The power mode should be selected from target conductivity, thermal behavior, and equipment capability. Many compound ceramic targets are first evaluated with RF magnetron sputtering.

Why are density and microstructure important for Tungsten Nickel Boride targets?

Uniform density and microstructure help support stable erosion and thermal behavior, while pores or local defects can increase the risk of cracking, particles, or unstable plasma.

Can a Tungsten Nickel Boride target be supplied with a backing plate?

Yes. Where the material is brittle or the cathode requires a backing assembly, bonded configurations can be reviewed according to target size, thickness, cooling, and operating power.

Does target composition always equal film composition?

No. Film chemistry can shift because of different sputtering yields, reactive conditions, substrate temperature, re-sputtering, or chamber history. Verify the film when the chemistry is critical.

What should I provide to request a quotation for Tungsten Nickel Boride?

Please provide material composition, purity, dimensions, quantity, target or backing configuration, cathode model or system details, and any drawing, tolerance, or inspection requirements.

Prepare your RFQ: Download the fillable Tungsten Nickel Boride Sputtering Target, WNiB RFQ Worksheet (PDF). Enter the required composition or grade, dimensions, backing or bonding request, quantity, documents, and acceptance criteria for quotation review.

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WNiB Target 99.7% ø3"*6mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

Manufacturing routes depend on the material and target specification. Metal targets may be cast and machined, while some ceramic targets are consolidated by sintering. Ask for the product-specific route and inspection criteria when these affect qualification.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Bonding may be selected for brittle targets, thinner precious-metal targets, or a cathode that needs a specific backing and cooling arrangement. It is not a universal requirement. Provide target and backing dimensions, the cathode model, and operating conditions for assembly review.

 

DC is commonly used with conductive targets. RF is often used for poorly conducting or insulating targets to mitigate surface charging; other power modes may be suitable depending on the target, cathode, and process. Confirm the mode against the equipment and material.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Customer-supplied powder acceptance is not assumed. Provide material identity, lot traceability, composition and impurity analysis, quantity, and handling constraints in the RFQ. TFM must confirm feasibility and acceptance criteria before any material is sent.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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