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ST0147A Europium Sulfide Sputtering Target, EuS

Chemical Formula: EuS
Catalog Number: ST0147A
CAS Number: 12034-21-8
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Europium Sulfide sputtering targets come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Europium Sulfide (EuS) Sputtering Targets are specialized compound targets used in thin film deposition processes for magnetic materials research, spintronics, and advanced semiconductor applications. EuS is a rare-earth chalcogenide known for its unique ferromagnetic semiconductor properties, making it particularly valuable for experimental electronic and spin-based devices.

In Physical Vapor Deposition (PVD) systems such as RF magnetron sputtering, EuS targets enable the deposition of high-quality europium sulfide thin films with controlled composition and crystalline structure. These films are widely investigated in spintronic devices, magneto-optical materials, and quantum materials research, where rare-earth sulfide compounds provide unique magnetic and electronic behavior.

Detailed Description

Europium Sulfide Sputtering Targets are typically manufactured using high-purity europium and sulfur compounds through advanced ceramic synthesis methods such as solid-state reaction, hot pressing, or sintering. These processes ensure uniform composition, high density, and stable microstructure, which are essential for reliable sputtering performance.

EuS belongs to the class of rare-earth chalcogenide semiconductors, which exhibit interesting electronic and magnetic properties. One of its most distinctive features is its ferromagnetic behavior at low temperatures, making europium sulfide an important material in fundamental physics research and spintronic device development.

Because EuS is a ceramic semiconductor compound with limited electrical conductivity, deposition is typically carried out using RF magnetron sputtering, which provides stable plasma conditions and consistent thin film growth.

EuS thin films can exhibit properties such as:

  • ferromagnetic semiconductor behavior

  • strong spin polarization

  • tunable electronic structure

  • compatibility with semiconductor substrates

These characteristics make EuS thin films useful for studying spin transport, magnetic interfaces, and quantum electronic phenomena.

EuS sputtering targets are available in circular discs, rectangular plates, and custom geometries designed to match different sputtering cathodes. For larger targets or high-power sputtering systems, the targets may be bonded to copper backing plates using indium bonding or elastomer bonding to improve heat dissipation and mechanical stability.

High-density targets help maintain stable sputtering rates, reduce particle generation, and ensure uniform thin film deposition.

Applications

Thin films deposited from Europium Sulfide Sputtering Targets are used in several advanced research and technology fields:

  • Spintronics research – EuS thin films used for spin filtering and spin transport studies.

  • Magnetic semiconductor devices – experimental magnetic thin films for advanced electronics.

  • Quantum materials research – materials used in low-temperature quantum experiments.

  • Magneto-optical materials – rare-earth sulfide films for optical and magnetic applications.

  • Superconducting interface research – EuS layers used in hybrid superconducting structures.

  • Academic and industrial R&D – development of magnetic semiconductor materials.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%High purity improves magnetic and electronic film properties
Density≥95% theoreticalEnsures stable sputtering and uniform film growth
Diameter25 – 300 mm (custom)Compatible with various sputtering cathodes
Thickness3 – 6 mmInfluences sputtering rate and target lifetime
BondingCopper backing plate (optional)Improves heat transfer and mechanical stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Europium Sulfide (EuS)Ferromagnetic semiconductor propertiesSpintronics and magnetic materials research
Europium Oxide (Eu₂O₃)Strong luminescent propertiesOptical materials and phosphors
Gadolinium Sulfide (GdS)Magnetic semiconductor behaviorMagnetic thin film research

FAQ

QuestionAnswer
Can EuS sputtering targets be customized?Yes, target diameter, thickness, density, and backing plate bonding can be customized according to sputtering system requirements.
Which sputtering method is recommended for EuS targets?RF magnetron sputtering is commonly used due to the semiconductor nature of europium sulfide.
Are bonded targets available?Yes, EuS targets can be indium-bonded or elastomer-bonded to copper backing plates to improve thermal management.
What substrates are compatible with EuS thin films?Silicon wafers, sapphire, glass, and various oxide substrates are commonly used.
Which industries commonly use EuS sputtering targets?Spintronics research laboratories, semiconductor research facilities, and advanced materials science institutes.

Packaging

Our Europium Sulfide Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain strict quality control standards. Each target is vacuum-sealed and packaged with protective cushioning materials to prevent contamination or mechanical damage during storage and transportation. Export-grade cartons or wooden crates are used to ensure safe international delivery.

Conclusion

The Europium Sulfide (EuS) Sputtering Target is an advanced compound target used to deposit magnetic semiconductor thin films with unique spintronic and electronic properties. Its ferromagnetic semiconductor behavior makes it particularly valuable in spin transport studies, quantum materials research, and advanced semiconductor technologies.

With high purity levels, customizable dimensions, and stable sputtering performance, EuS sputtering targets provide reliable deposition materials for both research laboratories and advanced thin film manufacturing systems.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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EuS (Europium Sulfide) Sputtering Target 3N ø1"×5mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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