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Molybdenum Aluminum Boride Sputtering Target

Molybdenum Aluminum Boride Sputtering Target, MoAlB₂

Introduction

Molybdenum Aluminum Boride (MoAlB₂) Sputtering Target is an advanced layered ternary boride material belonging to the MAB phase family. Combining metallic and ceramic characteristics, MoAlB₂ exhibits excellent thermal stability, oxidation resistance, and mechanical robustness. These properties make it an emerging material for protective coatings, high-temperature applications, and advanced functional thin films. As a sputtering target, MoAlB₂ enables controlled deposition of boride-based coatings with unique structural and functional performance.

Detailed Description

Our MoAlB₂ Sputtering Targets are fabricated from carefully synthesized powders with tightly controlled stoichiometry to preserve the layered MAB phase structure. Maintaining accurate Mo–Al–B ratios is essential, as slight deviations can influence film hardness, oxidation resistance, and electrical conductivity.

The targets are consolidated through advanced sintering techniques to achieve high density and uniform microstructure. A dense, homogeneous target reduces particle ejection and ensures stable plasma conditions during sputtering. Depending on system requirements, MoAlB₂ targets can be used in RF sputtering systems and may be supplied unbonded or bonded to metallic backing plates to enhance heat dissipation and mechanical stability.

Applications

MoAlB₂ Sputtering Targets are primarily used in advanced thin film and coating research, including:

  • High-temperature protective coatings

  • Oxidation-resistant thin films

  • Wear-resistant and hard coatings

  • Functional boride-based surface layers

  • Advanced materials research on MAB phases

  • Energy and aerospace-related coating systems

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionMoAlB₂Determines layered boride properties
Purity99.9% – 99.99%Minimizes impurity-related defects
Diameter25 – 200 mm (custom available)Compatible with sputtering systems
Thickness3 – 6 mmInfluences sputtering lifetime
Density≥ 95% theoreticalImproves plasma stability
Sputtering ModeRF sputteringSuitable for ceramic/boride phases
BondingUnbonded / Cu backing (optional)Enhances thermal management

Comparison with Related Materials

MaterialKey AdvantageTypical Application
MoAlB₂Layered structure with oxidation resistanceHigh-temperature coatings
MoBHigh hardnessWear-resistant coatings
TiB₂Excellent hardness & conductivityCutting tools & protective films
MAX Phases (e.g., Ti₃AlC₂)Damage tolerance & machinabilityFunctional coatings

FAQ

QuestionAnswer
Can the target composition be customized?Yes, compositional adjustments and custom sizes are available.
Is RF sputtering recommended?Yes, RF sputtering is typically used for boride-based ceramic targets.
Are bonded targets available?Yes, metallic backing plates can be provided upon request.
How is the target packaged?Vacuum-sealed with protective cushioning and export-grade cartons or crates.

Packaging

Our Molybdenum Aluminum Boride (MoAlB₂) Sputtering Targets are carefully labeled and vacuum-sealed to ensure traceability and protection from contamination. Robust export-grade packaging prevents mechanical damage during storage and international transport.

Conclusion

Molybdenum Aluminum Boride (MoAlB₂) Sputtering Target offers a reliable platform for depositing advanced boride thin films with excellent oxidation resistance and mechanical strength. With controlled stoichiometry, high density, and flexible customization options, it is well suited for high-temperature, wear-resistant, and next-generation functional coating applications.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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MoAlB₂ target (Mo/Al/B = 1/1/2 at%) 99.95% ø50.8×3mm, MoAlB₂ target (Mo/Al/B = 1/1/2 at%) 99.95% ø50.8×5mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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