Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
Molybdenum Aluminum Boride Sputtering Target

Molybdenum Aluminum Boride Sputtering Target, MoAlB₂

Introduction to Molybdenum Aluminum Boride (MoAlB₂) Sputtering Target

The Molybdenum Aluminum Boride (MoAlB₂) Sputtering Target is an advanced ceramic–metal composite material used for thin-film deposition. Incorporating molybdenum (Mo), aluminum (Al), and boron (B), this compound belongs to the boride family, combining the thermal and mechanical stability of molybdenum, the oxidation resistance of aluminum, and the extreme hardness of boron. MoAlB₂ is particularly valued for its multifunctional performance in demanding thin-film applications.

Material Structure and Properties

  • Crystal Structure: MoAlB₂ forms a layered boride structure with strong metal–boron and boron–boron bonds, providing superior hardness and stability.

  • Refractory Behavior: Molybdenum contributes excellent high-temperature stability, high melting point (2623 °C for Mo), and robust mechanical strength.

  • Oxidation Resistance: Aluminum forms protective alumina (Al₂O₃) layers at elevated temperatures, improving corrosion resistance.

  • High Hardness & Wear Resistance: Boron bonding contributes to extreme hardness and enhanced wear performance of the films.

Key Features of MoAlB₂ Sputtering Target

  • High Density & Purity: Produced with densities above 95% of theoretical and purities of 99.5–99.9%, ensuring clean and efficient sputtering.

  • Stable Sputtering Performance: Resistant to cracking and spalling, with consistent deposition rates.

  • Film Quality: Enables uniform, dense, and well-adhered thin films.

  • Deposition Flexibility: Suitable for both RF and DC magnetron sputtering as well as pulsed laser deposition (PLD).

Applications

The MoAlB₂ sputtering target finds application in a wide range of advanced industrial and research sectors:

  1. Protective Hard Coatings – Thin, ultra-hard films for cutting tools, machining components, and wear parts.

  2. Aerospace & Automotive – Oxidation-resistant, high-temperature coatings for turbines, pistons, and structural components.

  3. Electronics & Semiconductors – Barrier layers, conductive interconnects, and protective coatings.

  4. Energy & Nuclear Fields – Radiation- and corrosion-resistant films for demanding environments.

  5. Research & Development – Exploration of new boride-based thin films with multifunctional mechanical, electrical, and optical properties.

Fabrication & Deposition

  • Manufacturing: MoAlB₂ targets are typically produced via solid-state sintering, hot-pressing, or spark plasma sintering (SPS) methods to achieve dense and durable targets.

  • Deposition Characteristics: Films sputtered from MoAlB₂ exhibit high hardness, excellent thermal stability, chemical resistance, and smooth morphology.

  • Compatibility: Performs well with RF/DC magnetron sputtering systems and PLD setups.

Order Now

MoAlB₂ target (Mo/Al/B = 1/1/2 at%) 99.95% ø50.8×3mm, MoAlB₂ target (Mo/Al/B = 1/1/2 at%) 99.95% ø50.8×5mm

Reviews

There are no reviews yet.

Be the first to review “Molybdenum Aluminum Boride Sputtering Target, MoAlB₂”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top