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Cobalt Iron Aluminum Sputtering Target, Co₂FeAl

Cobalt Iron Aluminum Sputtering Target

Introduction

The Cobalt Iron Aluminum Sputtering Target (Co₂FeAl) is a specialized alloy material widely used in thin film research and advanced device fabrication. Its unique combination of cobalt, iron, and aluminum provides tunable magnetic and structural properties, making it a valuable choice for spintronics, magneto-optical devices, and surface engineering applications.

Detailed Description

Co₂FeAl belongs to the family of Heusler alloys, known for their half-metallic ferromagnetic behavior. This property makes the sputtering target especially attractive for magnetic tunnel junctions and spintronic components, where electron spin polarization is critical. The alloy exhibits:

  • Stable crystal structure that promotes uniform thin film deposition.

  • High Curie temperature, ensuring thermal stability in magnetic films.

  • Adjustable magnetic properties based on deposition parameters and post-annealing conditions.

Targets are manufactured with high density and fine microstructure to minimize particle generation during sputtering, enhancing coating quality and reproducibility. Bonded options with copper or titanium back plates improve heat dissipation and operational stability in magnetron sputtering systems.

Applications

The Cobalt Iron Aluminum Sputtering Target is primarily used in:

  • Spintronics and magnetoresistive random-access memory (MRAM).

  • Magnetic tunnel junctions and read/write heads.

  • Thin film sensors and actuators.

  • Functional coatings in electronics and optics.

  • Fundamental research on half-metallic and Heusler alloys.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Higher purity ensures fewer defects in spintronic films
Diameter25 – 150 mm (customizable)Fits common sputtering systems
Thickness3 – 6 mmAffects sputtering lifetime and rate
BondingIndium / Copper backingImproves adhesion and heat transfer

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Cobalt Iron AluminumHalf-metallic ferromagnet, spin polarizationSpintronics, MRAM
Cobalt ChromiumCorrosion resistanceDecorative and protective films
Iron PlatinumHigh magnetic anisotropyHigh-density recording media

FAQ

QuestionAnswer
Can the target composition be adjusted?Yes, stoichiometry can be tailored according to research requirements.
What bonding options are available?Indium bonding or copper/titanium backing plates can be provided.
How is the target packaged?Vacuum-sealed, cushioned with protective foam, and shipped in export-safe crates.
What deposition techniques are suitable?Primarily magnetron sputtering, but also compatible with RF and DC sputtering systems.
Is customization possible?Yes, we supply custom dimensions, purities, and bonding services.

Packaging

Each Cobalt Iron Aluminum Sputtering Target is carefully vacuum-packed and labeled for traceability. External shock-absorbing layers and wooden crates are used for international shipments to prevent damage during transit.

Conclusion

The Co₂FeAl sputtering target is an advanced material solution for next-generation magnetic and electronic devices. Its unique half-metallic properties, combined with customizable sizes and high purity, make it a reliable choice for both industrial users and research institutions.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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