Introduction
Zinc Sputtering Targets are widely used deposition materials for producing functional thin films in electronics, optics, energy devices, and protective coatings. With good electrical conductivity, moderate melting point, and strong affinity for oxide formation, zinc targets are essential for applications such as transparent conductive oxides, surface passivation layers, and compound semiconductor research.
Detailed Description
Zinc sputtering targets are manufactured from high-purity zinc using controlled melting, casting, and precision machining processes to ensure uniform composition and consistent density. Due to zinc’s relatively low melting point and softness, careful control of target flatness, surface finish, and thermal management is critical for achieving stable sputtering performance and long service life.
Targets are available in unbonded form for small diameters and low-power applications, or bonded to copper backing plates for improved heat dissipation and mechanical stability during higher-power magnetron sputtering. Proper bonding helps prevent warping, localized overheating, and premature target degradation.
Zinc targets are compatible with DC magnetron sputtering and are commonly used in both metallic zinc film deposition and reactive sputtering processes (e.g., ZnO formation in oxygen-containing atmospheres).
Applications
Transparent conductive and oxide thin films (e.g., ZnO-based coatings)
Semiconductor and microelectronic devices
Display panels and optoelectronic components
Protective, decorative, and corrosion-resistant coatings
Thin film research and materials development
Technical Parameters
| Parameter | Typical Value / Range | Importance |
|---|---|---|
| Material | Zinc (Zn) | Functional metal for PVD |
| Purity | 99.9% – 99.999% | Impurity control affects film quality |
| Form | Disc / Plate (bonded or unbonded) | Fits sputtering systems |
| Diameter | 25 – 300 mm (custom) | Matches magnetron cathodes |
| Thickness | 3 – 6 mm (typical) | Influences target lifetime |
| Backing Plate | Copper (optional) | Improves heat dissipation |
| Sputtering Mode | DC / Reactive sputtering | Process flexibility |
Comparison with Related Materials
| Material | Key Advantage | Typical Application |
|---|---|---|
| Zinc (Zn) | Easy oxide formation | ZnO thin films |
| Aluminum (Al) | Lightweight, conductive | Metallization layers |
| Indium (In) | Soft metal, oxide electronics | Transparent electrodes |
FAQ
| Question | Answer |
|---|---|
| Can zinc sputtering targets be customized? | Yes, size, purity, thickness, and bonding can be tailored. |
| Are bonded zinc targets recommended? | Yes, copper-backed targets are preferred for higher power sputtering. |
| Is DC sputtering suitable for zinc? | Yes, zinc is commonly used with DC magnetron sputtering. |
| Can zinc targets be used for reactive sputtering? | Yes, they are widely used for ZnO and related oxide films. |
| Is a Certificate of Analysis provided? | Yes, CoA is available upon request. |
Packaging
Our Zinc Sputtering Targets are cleaned for vacuum service, individually labeled, and vacuum-sealed to prevent oxidation and contamination. Protective cushioning and export-grade cartons or wooden crates ensure safe transportation and storage.
Conclusion
Zinc Sputtering Targets provide stable sputtering behavior, high purity, and excellent process compatibility for a wide range of thin film applications. With flexible customization options and consistent quality control, they are a reliable choice for electronic, optical, and research-focused PVD processes.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.
Reviews
There are no reviews yet.