Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
Aluminum Scandium Sputtering Target

ST0065 Aluminum Scandium Sputtering Target, Al/Sc

Chemical Formula: Al/Sc
Catalog Number: ST0065
CAS Number: 7429-90-5 | 7440
Purity: 99%, 99.5%, 99.9%, 99.95%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Aluminum Scandium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

 

Aluminum Scandium Sputtering Target (Al-Sc)

Introduction

Aluminum Scandium (Al-Sc) Sputtering Targets are advanced materials widely used in thin film deposition, especially in the production of high-performance semiconductors, optoelectronics, and display technologies. By combining aluminum’s excellent conductivity with scandium’s unique structural benefits, Al-Sc alloys provide superior thin film characteristics compared to pure aluminum targets.

Detailed Description

The Aluminum Scandium Sputtering Target is typically prepared by alloying aluminum with a small percentage of scandium. Even trace additions of scandium significantly improve film adhesion, grain refinement, and thermal stability. This alloy system enhances the electronic properties of deposited films, enabling higher efficiency and durability.

  • Purity: Available up to 99.9% depending on application needs

  • Composition: Custom scandium doping levels (commonly 1–5 at%)

  • Shapes: Circular, rectangular, and custom dimensions

  • Bonding Options: Indium, elastomer, or copper backing for better thermal management

The targets are manufactured using vacuum melting, powder metallurgy, or hot-press sintering to ensure uniform composition and consistent sputtering performance.

Applications

Al-Sc sputtering targets are widely adopted in:

  • Semiconductor industry – thin films for integrated circuits

  • Display manufacturing – OLED, LCD, and next-generation displays

  • Optoelectronics – sensors and laser components

  • Thin film transistors (TFTs) – enhanced channel and gate performance

  • Energy applications – photovoltaic devices and advanced coatings

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% (3N)Ensures low contamination
Composition1–5 at% Sc in Al (customizable)Enhances electrical & mechanical performance
Diameter25 – 300 mm (custom sizes)Matches system requirements
Thickness3 – 6 mmControls sputtering rate
BondingIndium, Elastomer, Copper backingImproves heat transfer and stability
Process MethodPowder metallurgy / Vacuum castingEnsures uniform microstructure

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Aluminum Scandium (Al-Sc)Improved adhesion & grain refinementSemiconductors, TFTs
Pure Aluminum (Al)Cost-effective, conductiveGeneral coatings
Aluminum-Silicon (Al-Si) AlloyHigh wear resistancePower electronics

Frequently Asked Questions (FAQ)

QuestionAnswer
Can scandium content be customized?Yes, we offer different scandium doping levels based on customer needs.
What is the delivery time?Normally 2–3 weeks, depending on size and order quantity.
How are the targets packaged?Vacuum-sealed with protective foam in export-safe cartons or crates.
What industries use Al-Sc targets most?Semiconductor, display, optoelectronics, and photovoltaic industries.

Conclusion

Aluminum Scandium Sputtering Targets combine the conductivity of aluminum with the structural advantages of scandium, making them ideal for high-performance thin films. With customizable compositions, strict purity control, and various bonding options, these targets are well-suited for cutting-edge research and industrial production.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Order Now

AlSc Target Al70Sc30 At% 99.9% ø101.6*6mm, AlSc Target AlSc 60:40 ø50.8*6.35mm Bonded to Cu B/Plate (ø50.8*2.54mm), AlSc target 0.3%–0.5% wt% 4N 780×100×25 mm

Reviews

There are no reviews yet.

Be the first to review “ST0065 Aluminum Scandium Sputtering Target, Al/Sc”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top