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ST0092 Iron Chromium Sputtering Target, Fe/Cr

Chemical Formula: Fe/Cr
Catalog Number: ST0092
CAS Number: 7439-89-6 | 7440
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Iron Chromium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Iron Chromium (Fe/Cr) Sputtering Targets are alloy materials engineered for depositing corrosion-resistant, wear-resistant, and functional metallic thin films. By combining iron’s structural strength with chromium’s oxidation and corrosion resistance, Fe/Cr alloy targets enable the formation of durable coatings widely used in industrial tooling, electronics, decorative finishes, and functional surface engineering.

Fe/Cr thin films are particularly valued for their stability in aggressive environments and their tunable magnetic and mechanical properties, making them suitable for both research and large-scale industrial coating systems.

Detailed Description

Iron Chromium sputtering targets are produced as homogeneous alloy materials with controlled Fe/Cr ratios. Common compositions range from low-chromium structural alloys to higher chromium content formulations designed to enhance oxidation resistance and hardness.

Manufacturing methods typically include vacuum induction melting (VIM), vacuum arc melting, or powder metallurgy followed by hot isostatic pressing (HIP). These processes ensure:

  • Uniform elemental distribution

  • Stable microstructure

  • High density (≥ 99% theoretical density typical)

  • Minimal segregation or secondary phases

Precise composition control directly influences film properties such as corrosion resistance, hardness, magnetic permeability, and adhesion to substrates. During sputtering, chromium contributes to the formation of protective oxide layers, while iron enhances mechanical strength and structural integrity.

Fe/Cr sputtering targets are compatible with DC magnetron sputtering due to their metallic conductivity. For high-power or large-area coating systems, targets can be indium-bonded to copper backing plates to improve heat dissipation and extend service life.

Applications

Iron Chromium sputtering targets are widely used in:

  • Corrosion-Resistant Coatings
    Protective films for industrial tools, automotive components, and machinery parts.

  • Wear-Resistant Thin Films
    Surface engineering for improved hardness and durability.

  • Magnetic & Functional Films
    Tailored magnetic properties for specialized electronic applications.

  • Decorative & Architectural Coatings
    Durable metallic finishes with improved oxidation resistance.

  • Semiconductor Equipment Components
    Protective layers in vacuum and processing environments.

  • Research & Materials Development
    Alloy thin-film studies in academic and industrial laboratories.

Technical Parameters

ParameterTypical Value / RangeImportance
CompositionCustom Fe/Cr ratio (e.g., 80/20, 70/30 wt%)Controls corrosion & magnetic behavior
Purity99.9% – 99.99%Reduces impurity-related defects
Density≥ 99% theoretical densityEnsures stable sputtering rate
Diameter1″ – 8″ (custom sizes available)Fits various cathode systems
Thickness3 – 10 mmInfluences target lifetime
BondingIndium bonded to Cu backing optionalEnhances thermal stability
Sputtering MethodDC magnetron preferredSuitable for metallic alloys

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Iron Chromium (Fe/Cr)Balanced strength & corrosion resistanceProtective coatings
Pure Iron (Fe)High magnetic permeabilityMagnetic films
Pure Chromium (Cr)Excellent oxidation resistanceHard protective layers
Stainless Steel AlloysComplex alloy system with added elementsStructural & decorative films

Fe/Cr targets are selected when a controllable combination of mechanical strength and corrosion resistance is required without introducing additional alloying elements.

FAQ

QuestionAnswer
Can the Fe/Cr ratio be customized?Yes, composition can be tailored to meet specific corrosion or magnetic performance requirements.
Is bonding recommended for large targets?Yes, copper backing plates improve heat management and reduce cracking risk.
What sputtering method is recommended?DC magnetron sputtering is typically used due to the alloy’s electrical conductivity.
Are rotary targets available?Yes, rotary configurations can be supplied for in-line coating systems.
How is the product packaged?Vacuum-sealed with protective cushioning and export-grade cartons or wooden crates.

Packaging

Our Iron Chromium Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.

Conclusion

Iron Chromium (Fe/Cr) Sputtering Targets offer a versatile solution for depositing durable, corrosion-resistant metallic thin films. With controlled composition, high density, and customizable geometries, they support reliable performance in industrial coating systems and advanced materials research.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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