Product Overview
Nickel Manganese Sputtering Target (Ni/Mn) is an alloy sputtering target used to deposit composition-controlled alloy films. Relative to a pure elemental target, the alloying constituents are introduced to tune electrical, magnetic, optical, mechanical, or adhesion-related film properties. For this reason, alloy ratio, homogeneity, purity basis, and the intended film composition should be defined clearly in the procurement specification.
Material and Deposition Characteristics
Many alloy targets are electrically conductive and can be compatible with DC or pulsed-DC magnetron sputtering, subject to the actual alloy composition and equipment capability. The target composition is not always reproduced exactly in the deposited film because preferential sputtering, re-sputtering, substrate heating, and process gas conditions can shift the final ratio. For composition-sensitive work, deposited-film analysis should be part of process qualification.
Technical Data
| Parameter | Typical Value / Range | Importance |
|---|---|---|
| Purity | 99.9% – 99.99% | Higher purity improves film quality and reduces contamination |
| Composition Ratio | Ni/Mn customizable (e.g., 90/10, 80/20, 50/50) | Determines electrical and magnetic properties |
| Density | ≥ 99% theoretical density | Ensures stable sputtering rate |
| Diameter | 25 – 300 mm (custom) | Compatible with various sputtering systems |
| Thickness | 3 – 6 mm | Affects sputtering lifetime and thermal stability |
| Bonding | Copper backing plate optional | Improves heat dissipation and target durability |
| Material | Key Advantage | Typical Application |
|---|---|---|
| Nickel Manganese (Ni/Mn) | Tunable magnetic and electrical properties | Magnetic films, sensors |
| Nickel Chromium (Ni/Cr) | Excellent corrosion resistance and stability | Thin film resistors |
| Cobalt Manganese (Co/Mn) | Strong magnetic characteristics | Magnetic storage and spintronic devices |
| Nickel Iron (Ni/Fe) | High magnetic permeability | Magnetic shielding and sensors |
| Question | Answer |
|---|---|
| Can the Nickel Manganese Sputtering Target be customized? | Yes, composition ratios, dimensions, purity levels, and bonding structures can be customized according to customer specifications. |
| Is a backing plate required? | For high-power sputtering systems, a copper backing plate is recommended to improve thermal conductivity and prevent thermal cracking. |
| Which sputtering methods can use Ni/Mn targets? | RF magnetron sputtering, DC sputtering, and other physical vapor deposition methods are commonly used. |
| What industries commonly use Ni/Mn sputtering targets? | Semiconductor manufacturing, magnetic device production, thin film electronics, and research institutions. |
| What forms of targets are available? | Planar targets, rotatable targets, and bonded assemblies are available depending on the sputtering system design. |
Typical Thin-Film Applications
- Nickel Manganese alloy films where composition control is important to electrical, mechanical, magnetic, or optical performance
- Multilayer stacks, adhesion/barrier layers, conductive films, or functional coatings depending on the alloy system
- Research and production programs that require customized alloy ratios and repeatable sputtering behavior
Target Configuration and Ordering Considerations
For quotation and manufacturability review, provide target size, thickness, purity or alloy composition, quantity, and the sputtering gun or cathode model if known. If a bonded assembly is required, include backing-plate material, bonding preference, and any dimensional tolerances, surface-finish needs, or inspection-document requirements. TFM can also review customer drawings or old-target samples for replacement builds.
Frequently Asked Questions
Can the composition of a Nickel Manganese sputtering target be customized?
Yes. For alloy targets, the required ratio should be specified clearly in wt% or at%. TFM can review custom compositions together with purity, dimensions, and manufacturability.
Will an alloy target always produce a film with the same composition?
Not necessarily. Preferential sputtering, substrate heating, process gas, and re-sputtering effects can shift the deposited composition relative to the nominal target chemistry. Film analysis should be used when the composition is critical.
Is a Nickel Manganese alloy target compatible with DC magnetron sputtering?
Many metallic alloy targets are electrically conductive and can be compatible with DC or pulsed-DC sputtering, but the final choice depends on the actual alloy system and equipment.
Why is alloy homogeneity important in a Nickel Manganese target?
A uniform alloy distribution helps support stable erosion and reduces local composition variation across the target, which in turn helps improve run-to-run consistency.
Can a Nickel Manganese target be supplied bonded?
Yes. Where the cathode or thermal load requires it, TFM can supply bonded assemblies. Backing-plate material, target thickness, bonding method, and operating power should be reviewed together.
What should I include in an RFQ for Nickel Manganese?
Specify the alloy composition, purity basis, dimensions, quantity, backing requirement, cathode model or drawing, and any tolerance, inspection, or documentation requirements.
Reviews
There are no reviews yet.