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ST0146 Erbium Oxide Sputtering Target, Er2O3

Chemical Formula: Er2O3
Catalog Number: ST0146
CAS Number: 12061-16-4
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Erbium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Er2O3 Sputtering Target Erbium Oxide Target Er2O3 Sputtering Target Erbium Oxide Target

Introduction

Erbium Oxide (Er₂O₃) Sputtering Targets are advanced ceramic deposition materials widely used in thin film technologies, particularly in optical, semiconductor, and electronic applications. As a rare-earth oxide with excellent optical and dielectric properties, erbium oxide plays an important role in modern thin film engineering and photonic devices.

In Physical Vapor Deposition (PVD) processes such as RF magnetron sputtering, Er₂O₃ targets are used to produce high-purity erbium oxide thin films with precise composition and stable optical characteristics. These films are especially valued in optical coatings, laser systems, and semiconductor devices where rare-earth elements contribute unique electronic transitions and luminescence properties.

Detailed Description

Erbium Oxide Sputtering Targets are typically manufactured using high-purity erbium oxide powders through advanced ceramic processing techniques such as cold isostatic pressing (CIP), sintering, or hot pressing. These methods produce dense, uniform targets with excellent structural integrity and stable sputtering performance.

Er₂O₃ is a chemically stable rare-earth oxide with high melting temperature and excellent resistance to thermal and chemical degradation. These characteristics make it suitable for demanding thin film deposition processes that require long target lifetimes and consistent film quality.

During sputtering deposition, Er₂O₃ targets are usually operated using RF magnetron sputtering, which is preferred for insulating ceramic materials. The resulting thin films exhibit good optical transparency, dielectric strength, and luminescent properties. Erbium ions are particularly known for their optical emission around 1.55 μm, a wavelength widely used in optical communication systems.

Er₂O₃ targets can be supplied in a variety of geometries including circular discs, rectangular plates, and custom shapes compatible with different sputtering systems. For larger targets or high-power sputtering systems, the material may be bonded to a copper backing plate using indium bonding or elastomer bonding to enhance heat dissipation and improve operational stability.

High-density erbium oxide targets minimize particle generation and arcing during deposition, ensuring smoother thin films and higher deposition efficiency in semiconductor and optical coating environments.

Applications

Thin films produced using Erbium Oxide Sputtering Targets are widely used across advanced technology sectors:

  • Optical coatings – used in infrared optical coatings and anti-reflective layers.

  • Optical communication devices – erbium-doped materials are essential for fiber amplifiers and photonic components.

  • Semiconductor thin films – used in dielectric layers and advanced microelectronic structures.

  • Laser and photonic materials – erbium ions provide strong luminescent properties useful in lasers and optical amplifiers.

  • Display and photonics research – used in functional optical thin films and luminescent coatings.

  • Protective coatings – erbium oxide layers offer chemical and thermal stability for specialized environments.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Higher purity improves optical transparency and film performance
Density≥95% theoreticalHigher density improves sputtering stability and target lifetime
Diameter25 – 300 mm (custom)Compatible with various sputtering systems
Thickness3 – 6 mmInfluences sputtering rate and film uniformity
BondingCopper / Titanium backing plate (optional)Improves heat transfer and mechanical stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Erbium Oxide (Er₂O₃)Strong infrared luminescence at 1.55 μmOptical amplifiers and photonic devices
Yttrium Oxide (Y₂O₃)Excellent dielectric propertiesProtective and optical coatings
Lanthanum Oxide (La₂O₃)High refractive indexOptical and electronic thin films

FAQ

QuestionAnswer
Can the Er₂O₃ sputtering target be customized?Yes, diameter, thickness, purity, and bonding options can be customized based on deposition system requirements.
What sputtering method is recommended for Er₂O₃ targets?RF magnetron sputtering is commonly used for ceramic oxide targets to maintain stable plasma conditions.
Are bonded targets available?Yes, erbium oxide targets can be indium-bonded or elastomer-bonded to copper backing plates for better thermal management.
What substrates are commonly used with Er₂O₃ films?Silicon wafers, quartz, sapphire, glass, and oxide substrates are commonly used depending on the application.
Which industries use erbium oxide sputtering targets most frequently?Optical communications, semiconductor manufacturing, photonics research, and advanced optical coating industries.

Packaging

Our Erbium Oxide Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.

Conclusion

The Erbium Oxide (Er₂O₃) Sputtering Target is an essential material for producing high-performance optical and electronic thin films. Its excellent optical properties, chemical stability, and compatibility with RF sputtering make it a reliable choice for applications in photonics, semiconductor devices, and optical coatings.

With customizable dimensions, high purity levels, and reliable bonding options, erbium oxide sputtering targets can meet the demanding requirements of both research laboratories and industrial thin film production.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Order Now

Er2O3 Sputtering Target, 99.99%, with 3mm Indium Bonding Copper Backing Plate ø101.6*3.0mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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