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ST0191 Tantalum Oxide Sputtering Target, Ta2O5

Chemical Formula: Ta2O5
Catalog Number: ST0191
CAS Number: 1314-61-0
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tantalum Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Tantalum Oxide Sputtering Target (Ta₂O₅) is a high-performance ceramic target widely used for depositing high-refractive-index dielectric films and high-k insulating layers. Known for its excellent optical transparency, chemical stability, and high dielectric constant, Ta₂O₅ plays a critical role in optical coatings, semiconductor devices, and advanced electronic components.

In magnetron sputtering systems, Ta₂O₅ targets enable the production of dense, uniform thin films with controlled stoichiometry. High purity and phase stability are essential to achieving consistent optical and electrical properties.

Detailed Description

Tantalum pentoxide (Ta₂O₅) is a refractory oxide ceramic with a melting point above 1800°C and a dielectric constant typically in the range of 20–25 (depending on deposition conditions). For sputtering applications, the material is produced through high-purity powder synthesis followed by controlled sintering to achieve dense, homogeneous ceramic bodies.

Key manufacturing features include:

  • High phase purity to avoid sub-oxide formation

  • Controlled oxygen stoichiometry

  • High density (≥95% theoretical) to reduce particle generation

  • Uniform grain structure for stable sputtering rate

As an insulating oxide, Ta₂O₅ is typically used in RF magnetron sputtering systems. For high-power deposition or large-area coatings, bonding to a copper backing plate is recommended to improve thermal conductivity and mechanical stability.

Deposited Ta₂O₅ films are characterized by:

  • High refractive index (~2.05–2.15 at 550 nm)

  • Excellent optical transparency from visible to near-IR

  • High dielectric constant

  • Good chemical and thermal stability

These properties make Ta₂O₅ suitable for both optical multilayer stacks and electronic device applications.

Applications

Tantalum Oxide Sputtering Targets are widely used in:

  • Optical interference coatings

  • High-refractive-index layers in multilayer filters

  • Capacitors and dielectric layers in microelectronics

  • Gate dielectrics and high-k materials research

  • Laser optics and precision optical components

  • Protective dielectric coatings

  • Thin film photovoltaic research

In optical coating systems, Ta₂O₅ is frequently paired with low-index materials such as SiO₂ to create high-performance multilayer structures.

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical FormulaTa₂O₅Defines dielectric & optical properties
Purity99.9% – 99.99%Reduces absorption & leakage currents
Diameter25 – 200 mm (custom)Matches sputtering cathodes
Thickness3 – 6 mmInfluences target lifetime
Density≥ 95% theoreticalMinimizes particle contamination
BondingCopper backing plate (optional)Enhances heat dissipation

Custom dimensions, segmentation, and bonding configurations are available upon request.

Comparison with Related Dielectric Targets

MaterialKey AdvantageTypical Application
Ta₂O₅High refractive index & high-k dielectricOptical filters & capacitors
SiO₂Low refractive indexAR coatings & insulation
HfO₂Very high-k dielectricAdvanced semiconductor devices
Al₂O₃Good dielectric strengthProtective coatings

Compared to SiO₂, Ta₂O₅ offers a significantly higher refractive index, making it ideal for high-contrast optical stacks. Compared to HfO₂, Ta₂O₅ provides a balance of dielectric performance and optical transparency.

FAQ

QuestionAnswer
Is RF sputtering required?Yes, Ta₂O₅ is an insulating oxide and typically requires RF magnetron sputtering.
Can it be used for high-k dielectric films?Yes, Ta₂O₅ is widely used in capacitor and dielectric applications.
Is bonding recommended?For high-power deposition, bonded targets improve thermal stability.
Are custom sizes available?Yes, diameter, thickness, and backing options can be tailored.
Do you provide material certification?Yes, chemical composition and batch traceability documents are available.

Packaging

Our Tantalum Oxide Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. Each target is protected with flange covers (if bonded) and secure packaging to prevent mechanical damage during storage and transportation.

Conclusion

Tantalum Oxide Sputtering Targets (Ta₂O₅) provide a reliable solution for high-refractive-index optical films and high-k dielectric applications. With controlled purity, stable sputtering performance, and customizable configurations, they support advanced optical coating and semiconductor manufacturing processes.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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