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ST0289 Zinc Sulfide Sputtering Target, ZnS

Chemical Formula: ZnS
Catalog Number: ST0289
CAS Number: 1314-98-3
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zinc Sulfide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Zinc Sulfide (ZnS) Sputtering Target is a compound ceramic target widely used for depositing high-quality optical and functional thin films. Known for its wide bandgap, excellent infrared transparency, and stable chemical properties, ZnS is a critical material in optical coatings, display technologies, and semiconductor applications.

As a sputtering target, ZnS enables precise control over film thickness, refractive index, and composition in RF or magnetron sputtering systems. It is particularly valued in multilayer optical stacks and infrared components where optical clarity and environmental stability are essential.


Detailed Description

Zinc Sulfide is a II–VI compound semiconductor with a wide bandgap (~3.6 eV for cubic ZnS), making it highly transparent in the visible and infrared regions. It exhibits low absorption losses and favorable refractive index characteristics, making it ideal for anti-reflection coatings, IR windows, and optical filters.

ZnS sputtering targets are typically manufactured using hot pressing or vacuum sintering processes to achieve high density (≥ 95–99% of theoretical density). High density is critical to ensure:

  • Stable sputtering rates

  • Reduced particle generation

  • Uniform thin film deposition

  • Improved target lifetime

Purity levels generally range from 99.9% to 99.99%, depending on the application. Tight control of oxygen and metallic impurities is essential, as contamination can affect film transparency and electrical behavior.

Targets are available in various configurations:

  • Planar targets (round or rectangular)

  • Bonded to copper backing plates for enhanced heat dissipation

  • Custom dimensions compatible with standard sputtering systems

ZnS is typically used with RF sputtering due to its semiconducting nature, although certain systems may allow pulsed DC sputtering depending on configuration.

Deposited ZnS films are characterized by:

  • High optical transmission in visible and IR ranges

  • Good adhesion to glass, silicon, and polymer substrates

  • Stable refractive index

  • Chemical resistance under moderate environmental conditions


Applications

Zinc Sulfide sputtering targets are widely used in:

  • Optical Coatings – Anti-reflection coatings and high-refractive-index layers

  • Infrared Windows & Lenses – IR-transparent films for imaging systems

  • Display Technologies – Functional layers in thin film displays

  • Semiconductor Devices – Buffer or insulating layers

  • Decorative & Protective Coatings – Transparent protective films

  • Photonic & Sensor Devices – Waveguide and optical sensing applications

Its combination of transparency and durability makes ZnS a preferred material in precision optical systems.


Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Improves optical clarity and film consistency
Density≥ 95% – 99% of theoreticalEnsures stable sputtering and reduced arcing
Diameter25 – 300 mm (custom)Matches sputtering system holders
Thickness3 – 6 mm (typical)Influences sputtering rate and lifetime
BondingCopper backing plate (optional)Enhances thermal conductivity and stability
Sputtering MethodRF Magnetron (typical)Suitable for semiconducting targets

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Zinc Sulfide (ZnS)High IR transparency & stable indexOptical multilayers
Zinc Oxide (ZnO)Conductive & transparentTransparent electrodes
Magnesium Fluoride (MgF₂)Low refractive indexAnti-reflection coatings
Silicon Nitride (Si₃N₄)High hardness & durabilityProtective coatings

Compared to MgF₂, ZnS offers a higher refractive index, making it suitable as a high-index layer in multilayer optical stacks.


FAQ

QuestionAnswer
Can the ZnS sputtering target be customized?Yes, diameter, thickness, purity, and bonding options can be tailored to your system requirements.
Is RF sputtering required?Typically yes, due to ZnS’s semiconducting properties.
What substrates are compatible?Glass, silicon wafers, ceramics, and certain polymers.
How is the target packaged?Vacuum-sealed with protective foam and export-grade cartons or wooden crates.
Which industries use ZnS most?Optics, infrared imaging, semiconductor manufacturing, and photonics research.

Packaging

Our Zinc Sulfide Sputtering Target are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.


Conclusion

Zinc Sulfide (ZnS) Sputtering Targets provide a dependable solution for high-performance optical and functional thin film deposition. With high density, controlled purity, and customizable configurations, ZnS targets support demanding applications in optics, infrared systems, and advanced electronics.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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