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ST0341 Gadolinium Zirconate Sputtering Target, Gd2Zr2O7

Chemical Formula:Ā Gd2Zr2O7
Catalog Number: ST0341
CAS Number:
Purity:Ā 0.995
Shape:Ā Discs, Plates, Column Targets, Step Targets, Custom-made

Gadolinium ZirconateĀ  sputtering targetĀ  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Gadolinium Zirconate Sputtering Target Description

Gadolinium

Gadolinium is a chemical element with the symbol “Gd” and an atomic number of 64. It is named after Johan Gadolin, a chemist, physicist, and mineralogist. Gadolinium was first mentioned in 1880 and observed by Jean Charles Galissard de Marignac. The isolation of gadolinium was later accomplished and announced by Paul Ɖmile Lecoq de Boisbaudran. It is located in Period 6 and Group 3 of the periodic table, belonging to the f-block elements. The relative atomic mass of gadolinium is approximately 157.25 Daltons, with the number in parentheses indicating a margin of uncertainty.

Related Product: Gadolinium Sputtering Target

ZirconiumZirconium is a chemical element with the symbol “Zr” and an atomic number of 40. The name “zirconium” originates from the Persian word ‘zargun,’ meaning gold-colored. It was first mentioned in 1789 and observed by Martin Heinrich Klaproth. The isolation of zirconium was later accomplished and announced by Jƶns Jakob Berzelius. Zirconium is located in Period 5 and Group 4 of the periodic table, belonging to the d-block elements. Its relative atomic mass is approximately 91.224 Daltons, with the number in parentheses indicating a margin of uncertainty.

Related Product: Zirconium Sputtering Target

Gadolinium Zirconate Sputtering Target Application

The Gadolinium Zirconate Sputtering Target is utilized in a variety of applications, including thin film deposition and decorative coatings. It is widely employed in the semiconductor industry, display technologies, and the production of LEDs and photovoltaic devices. Additionally, this material is significant for functional coatings, the optical information storage industry, glass coatings for automotive and architectural glass, and optical communication technologies.

Gadolinium Zirconate Sputtering TargetĀ Packaging

Our Gadolinium Zirconate Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take extensive precautions to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.

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TFM offers Gadolinium Zirconate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

Itā€™s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Alā‚‚Oā‚ƒ, SiOā‚‚, TiOā‚‚), alloys, or compositesā€”chosen based on the filmā€™s desired properties.

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They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

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In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

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Key factors include the targetā€™s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

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Operators monitor target erosion (often by measuring the depth of the eroded ā€œrace trackā€) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

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Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

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DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the targetā€™s surface.

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In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also ā€œpoisonā€ the target surface if not carefully controlled.

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Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

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Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

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