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Silver Sulfide (Ag2S) Sputtering Target

ST0410 Silver Sulfide (Ag2S) Sputtering Target

Chemical Formula: Ag2S
Catalog Number: ST0410
CAS Number: 21548-73-2
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Silver Sulfide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Target Bonding of Silver Sulfide Sputtering Target

Specialized bonding services for Silver Sulfide (Ag2S) Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Specification of Silver Sulfide Sputtering Target

Material TypeSilver Sulfide
SymbolAg2S
Color/AppearanceDark grey to black, Solid
Melting Point 825°C
SputterRF, RF-R, DC
Type of BondIndium, Elastomer

Description of Silver Sulfide Sputtering Target

Silver

Silver, also known as argentum, is a chemical element with the symbol “Ag” and an atomic number of 47. The name “silver” originates from the Anglo-Saxon word ‘siolfur,’ and ‘argentum’ is the Latin term. Silver has been used since before 5000 BC. It is located in Period 5 and Group 11 of the periodic table, belonging to the d-block elements. Its relative atomic mass is approximately 107.8682 Daltons, with the number in parentheses indicating a margin of uncertainty.

Silver is a soft, white, lustrous transition metal with the highest electrical conductivity, thermal conductivity, and reflectivity of any metal. Silver sputtering targets are used for decorative coatings and antibiotic coatings in medical devices.

Related Product:  Silver Sputtering Target

SulfurSulfur, also known as sulphur, is a chemical element with the symbol “S” and an atomic number of 16. The name “sulfur” originates either from the Sanskrit word ‘sulvere’ or the Latin word ‘sulfurium,’ both referring to sulfur. Sulfur has been used since before 2000 BC and was discovered by ancient Chinese and Indian civilizations. It is located in Period 3 and Group 16 of the periodic table, belonging to the p-block elements. The relative atomic mass of sulfur is approximately 32.065 Daltons, with the number in parentheses indicating a margin of uncertainty.

Manufacturing Process

  1. Manufacturing
    • Cold Pressing: The initial form of the sputtering target is created by cold pressing high-purity material into the desired shape and size.
    • Sintering: The pressed material is then sintered at high temperatures to increase its density and strength.
    • Elastomer Bonding: The sintered target is elastomer bonded to a backing plate to ensure stability and durability during use.
  2. Cleaning and Final Packaging
    • Cleaning: The targets are meticulously cleaned to be suitable for use in vacuum environments, ensuring no contaminants affect their performance.
    • Protection from Environmental Contaminants: Measures are taken to protect the targets from environmental contaminants that could compromise their quality.
    • Protection During Shipment: The targets are carefully packaged to prevent any damage during transportation, ensuring they arrive in perfect condition for use.

Packing

Our Silver Sulfide Sputtering Target is clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to prevent any damage that might occur during storage or transportation, ensuring the product arrives in perfect condition.

Get Contact

TFM offers Silver Sulfide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.
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Ag₂S Target 4N ø50.0*3.0mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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