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ST0419 Iridium Oxide Sputtering Target, IrO2

Chemical Formula: IrO2
Catalog Number: ST0419
CAS Number:12030-49-8
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Iridium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File
IrO2 Target Structure

Iridium Oxide Sputtering Target Description

The Iridium Oxide Sputtering Target from TFM contains iridium (Ir) and oxygen (O). Iridium oxide (IrO2) is a blue-black solid and is the only well-characterized oxide of iridium. The structure of IrO2 is similar to the rutile structure of TiO2, featuring six-coordinate iridium and three-coordinate oxygen. There are several methods for obtaining iridium oxide, which can be categorized into modification and reactive deposition techniques.

Related Product: Iridium Sputtering Target

Iridium

Iridium is a rare, hard, lustrous, brittle, and very dense metal that resembles platinum. Chemically, it is almost as unreactive as gold and is known for being the most corrosion-resistant metal, resisting attack by any acid. Iridium is generally credited with being the second densest element after osmium based on measured density, although calculations involving the space lattices of the elements indicate that iridium is actually denser.

Iridium Oxide Sputtering Target Specification

Material TypeIridium Oxide
SymbolIrO2
Color/AppearanceBlack Target
Melting Point1,100° C (2,012° F)
Boiling PointN/A
Density11.7 g/cm3
Type of BondIndium, Elastomer
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Iridium Oxide Sputtering Target Applications

The Iridium Oxide (IrO2) Sputtering Target is used for thin film deposition in various applications, including fuel cells, decoration, semiconductors, displays, LEDs, photovoltaic devices, and glass coatings. IrO2 is also utilized in conjunction with other rare oxides, such as titanium nitride, in the coating of anode electrodes for industrial electrolysis and in microelectrodes for electrophysiology research.

Iridium Oxide Sputtering Target Bonding Services

Specialized bonding services for Iridium oxide Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Packaging

IrO2 sputter coater target is carefully packaged in the plastic vacuum bag to prevent damage during storage and transportation and to preserve the quality of our products in their original condition. Also, the COA of the raw material would be packaged with the product.

Get Contact

TFM offers Iridium Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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