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ST0456 Magnesium Zinc Oxide Sputtering Target

Chemical Formula: Mg(1-x)ZnxO
Catalog Number: ST0456
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

magnesium zinc oxide  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Magnesium Zinc Oxide (MgZnO) Sputtering Target is a tunable wide-bandgap oxide material widely used in optoelectronics, ultraviolet (UV) photodetectors, and transparent electronic devices. By alloying magnesium oxide (MgO) into zinc oxide (ZnO), the bandgap of the material can be precisely engineered, enabling control over optical absorption and electronic properties. MgZnO thin films are particularly attractive for UV-sensitive devices and high-performance transparent conductive structures.

Detailed Description

Our Magnesium Zinc Oxide Sputtering Targets are fabricated from high-purity ZnO and MgO powders with carefully controlled Mg incorporation levels. The magnesium content directly influences bandgap width, carrier concentration, and lattice parameters. Precise stoichiometric control ensures stable phase formation and reproducible film properties during deposition.

The targets are produced through advanced ceramic processing techniques, including homogeneous powder mixing, calcination, and high-temperature sintering to achieve high density and structural uniformity. A dense microstructure reduces particle ejection and enhances plasma stability during sputtering. Due to its ceramic oxide nature, MgZnO targets are typically deposited using RF sputtering systems, although reactive sputtering conditions may be optimized to fine-tune oxygen stoichiometry.

Targets are available in planar round, rectangular, or custom geometries and can be supplied unbonded or bonded to copper backing plates for improved thermal management in high-power deposition systems.

Applications

Magnesium Zinc Oxide Sputtering Targets are widely used in:

  • Ultraviolet (UV) photodetectors

  • Transparent electronics and optoelectronic devices

  • Wide-bandgap semiconductor research

  • Buffer layers in ZnO-based heterostructures

  • Transparent conducting oxide (TCO) applications

  • Thin film transistors and display technologies

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionMgₓZn₁₋ₓO (custom x value)Controls bandgap and conductivity
Purity99.9% – 99.99%Minimizes defect-related optical loss
Diameter25 – 300 mm (custom available)Compatible with sputtering cathodes
Thickness3 – 6 mmInfluences target lifetime
Density≥ 95% theoreticalImproves plasma stability
Sputtering ModeRF sputteringRequired for ceramic oxides
BondingUnbonded / Cu backing (optional)Enhances heat dissipation

Comparison with Related Oxide Materials

MaterialKey AdvantageTypical Application
MgZnOTunable wide bandgapUV photodetectors
ZnOHigh transparencyTransparent electronics
Al-doped ZnO (AZO)Improved conductivitySolar cells
Ga₂O₃Ultra-wide bandgapPower electronics

FAQ

QuestionAnswer
Can the magnesium content be customized?Yes, the Mg fraction (x value) can be tailored to achieve desired bandgap properties.
Is RF sputtering required?Yes, MgZnO is typically deposited using RF sputtering.
Are bonded targets available?Yes, copper backing plates can be supplied upon request.
How is the target packaged?Vacuum-sealed with protective foam and export-grade cartons or wooden crates.

Packaging

Our Magnesium Zinc Oxide Sputtering Targets are meticulously tagged and vacuum-sealed to ensure traceability and protection from moisture and contamination. Export-grade packaging safeguards the targets during storage and international transportation.

Conclusion

Magnesium Zinc Oxide (MgZnO) Sputtering Target provides a reliable solution for depositing wide-bandgap oxide thin films with tunable optical and electronic properties. With precise composition control, high density, and flexible customization options, it is well suited for UV optoelectronics, transparent devices, and advanced semiconductor research.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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