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Zinc Oxide with Scandia Sputtering Target

ST0478 Zinc Oxide with Scandia Sputtering Target, ZnO/Sc2O3 98/02 wt%

Chemical Formula: ZnO/Sc2O3 98/02 wt%
Catalog Number: ST0478
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zinc Oxide with Scandia sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Zinc Oxide with Scandia Sputtering Target (ZnO–Sc₂O₃)

Introduction

Zinc Oxide with Scandia (ZnO–Sc₂O₃) Sputtering Target is a doped transparent conductive oxide (TCO) material designed to enhance electrical conductivity while maintaining high optical transparency. By introducing scandium oxide into the ZnO matrix, carrier concentration and structural stability can be precisely tuned, making this material suitable for advanced optoelectronic and functional coating applications. ZnO–Sc₂O₃ thin films are increasingly explored as alternatives to conventional TCO materials in energy and display technologies.

Detailed Description

Our Zinc Oxide with Scandia Sputtering Targets are manufactured from high-purity ZnO and Sc₂O₃ powders with carefully controlled doping levels. The scandium content is optimized to balance electrical conductivity, carrier mobility, and optical transmission. Precise stoichiometric control is critical, as variations in Sc concentration directly influence film resistivity and transparency in the visible spectrum.

The targets are produced using advanced ceramic processing methods, including powder blending, calcination, and high-temperature sintering, to achieve high density and homogeneous microstructure. A dense target body minimizes arcing and particle generation during sputtering, ensuring stable plasma conditions and uniform thin film growth. Due to its ceramic oxide nature, ZnO–Sc₂O₃ is typically deposited using RF sputtering systems, although reactive sputtering conditions may be adjusted to optimize oxygen stoichiometry in the film.

Targets are available in round, rectangular, or custom planar formats and can be supplied unbonded or bonded to copper backing plates for enhanced thermal management in high-power applications.

Applications

Zinc Oxide with Scandia Sputtering Targets are widely used in:

  • Transparent conductive oxide (TCO) thin films

  • Display panels and touch screens

  • Photovoltaic and solar cell coatings

  • Optoelectronic devices

  • Transparent electrodes and buffer layers

  • Academic and industrial R&D on doped ZnO systems

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionZnO–Sc₂O₃ (custom Sc content)Controls conductivity and transparency
Purity99.9% – 99.99%Reduces impurity-related optical loss
Diameter25 – 300 mm (custom available)Compatible with sputtering cathodes
Thickness3 – 6 mmInfluences target lifetime
Density≥ 95% theoreticalImproves plasma stability
Sputtering ModeRF sputteringRequired for ceramic oxides
BondingUnbonded / Cu backing (optional)Enhances heat dissipation

Comparison with Related TCO Materials

MaterialKey AdvantageTypical Application
ZnO–Sc₂O₃Tunable conductivity & stabilityTransparent electrodes
Al-doped ZnO (AZO)Cost-effective TCOSolar cells & displays
ITO (In₂O₃–SnO₂)High conductivityDisplays & touch panels
Ga-doped ZnO (GZO)Improved mobilityOptoelectronics

FAQ

QuestionAnswer
Can the scandium doping level be customized?Yes, Sc₂O₃ content can be tailored to meet conductivity and transparency requirements.
Is RF sputtering required?Yes, ZnO–Sc₂O₃ is typically deposited using RF sputtering.
Are bonded targets available?Yes, copper backing plates can be supplied upon request.
How is the target packaged?Vacuum-sealed with protective foam and export-grade cartons or wooden crates.

Packaging

Our Zinc Oxide with Scandia Sputtering Targets are meticulously tagged and vacuum-sealed to ensure traceability and protection from moisture and contamination. Export-grade packaging safeguards the targets during transportation and storage.

Conclusion

Zinc Oxide with Scandia (ZnO–Sc₂O₃) Sputtering Target offers a reliable solution for depositing high-performance transparent conductive oxide thin films with tunable electrical and optical properties. With precise composition control, high density, and flexible customization options, it is well suited for advanced optoelectronic, photovoltaic, and display applications.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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