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ST0481 Rubidium Sputtering Target, Rb

Chemical Formula: Rb
Catalog Number: ST0481
CAS Number: 7440-17-7
Purity: 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Rubidium  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Rubidium (Rb) is an alkali metal known for its exceptional reactivity and unique electronic properties, making it highly valuable in advanced research and specialized thin film applications. Rubidium Sputtering Targets are primarily used in environments where precise control of alkali metal doping or functional coatings is required. Their role is particularly important in emerging fields such as quantum technologies, photoelectric devices, and advanced materials research.

Detailed Description

Rubidium Sputtering Targets are manufactured from high-purity rubidium metal, typically processed and sealed under controlled environments due to the material’s high chemical reactivity, especially with oxygen and moisture. Unlike many conventional sputtering materials, rubidium requires specialized handling, vacuum packaging, and inert atmosphere processing to maintain its integrity.

These targets are commonly supplied in bonded configurations, such as indium-bonded or encapsulated designs, to improve thermal conductivity and ensure stability during sputtering. Because rubidium has a relatively low melting point and soft metallic structure, careful engineering of backing plates (e.g., copper or stainless steel) is essential to prevent deformation and ensure uniform sputtering performance.

The purity level of rubidium directly affects the consistency of deposited films, particularly in sensitive applications like semiconductor doping or optical coatings. High-purity rubidium minimizes contamination and enables precise control over electrical and optical properties in thin films.

Applications

Rubidium Sputtering Targets are used in a range of advanced and niche applications, including:

  • Alkali metal doping in semiconductor and optoelectronic devices
  • Quantum optics and atomic physics experiments
  • Photoelectric and photodetector materials
  • Specialized coatings for sensors and vacuum devices
  • Research in solid-state physics and energy materials

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.5% – 99.95%Ensures stable deposition and minimizes contamination
Diameter1″ – 6″ (custom available)Compatible with standard sputtering systems
Thickness2 – 5 mmAffects sputtering lifetime and rate
Density~1.53 g/cm³Influences sputtering yield
BondingIndium / Encapsulated backingImproves thermal stability and handling safety

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Rubidium (Rb)Strong electron donation, low ionization energyQuantum devices, alkali doping
Cesium (Cs)Even lower work functionPhotocathodes, vacuum tubes
Potassium (K)More stable than RbGeneral alkali doping

FAQ

QuestionAnswer
Can Rubidium Sputtering Targets be customized?Yes, dimensions, bonding type, and encapsulation can be tailored based on system requirements.
How should rubidium targets be stored?They must be stored in sealed, moisture-free environments, preferably under inert gas or vacuum packaging.
Are special sputtering conditions required?Yes, low power and controlled environments are recommended due to rubidium’s low melting point and high reactivity.
What industries typically use rubidium targets?Primarily research institutions, semiconductor R&D, and advanced optics laboratories.
Is bonding necessary for rubidium targets?In most cases, yes. Bonding improves mechanical stability and heat dissipation during sputtering.

Packaging

Our Rubidium Sputtering Target are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation. Each product is vacuum-sealed or packed under inert atmosphere conditions to avoid oxidation or contamination, ensuring the targets arrive in perfect condition.

Conclusion

Rubidium Sputtering Targets offer unique advantages for highly specialized thin film applications where precise electronic properties and alkali metal behavior are critical. With controlled manufacturing, high purity, and customizable configurations, they provide reliable performance for advanced research and industrial development.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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