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ST0533 Lithium Tetrachloroaluminate Sputtering Target, LiAlCl4

Chemical Formula: LiAlCl4
Catalog Number: ST0533
CAS Number: 14024-11-4
Purity: 99.9% ~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

lithium tetrachloroaluminate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Lithium Tetrachloroaluminate Sputtering Targets are specialized compound targets developed for advanced thin film research where lithium-containing halide chemistry is required. Commonly referenced as LiAlCl₄ sputtering targets, these materials are of growing interest in solid-state battery research, ion-conductive films, and electrolyte-related thin film studies, where precise lithium content and chemical uniformity are essential.

Detailed Description

Lithium Tetrachloroaluminate (LiAlCl₄) is a lithium–aluminum chloride compound that requires strict control during target fabrication due to its chemical sensitivity. Targets are manufactured using carefully synthesized precursor materials, followed by controlled consolidation to achieve uniform composition and sufficient mechanical integrity for sputtering.

Because LiAlCl₄ is moisture-sensitive, special attention is given to atmosphere control during processing, machining, and packaging. Targets are typically supplied as ceramic-like compound discs or plates, suitable for RF magnetron sputtering, which is commonly required for non-metallic or weakly conductive materials.

For larger diameters or higher power densities, LiAlCl₄ sputtering targets can be supplied bonded to compatible backing plates to improve thermal stability and reduce the risk of cracking during deposition. Custom sizes, thicknesses, and bonding solutions are available to match specific cathode designs and research objectives.

Applications

  • Solid-state battery and lithium electrolyte thin film research

  • Ion-conductive and halide-based functional coatings

  • Electrochemical and energy storage material studies

  • Advanced materials science and laboratory R&D

  • Exploratory thin film deposition involving lithium compounds

Technical Parameters

ParameterTypical Value / RangeImportance
MaterialLithium Tetrachloroaluminate (LiAlCl₄)Lithium-containing halide compound
Purity99.9% – 99.99% (total)Affects ionic and chemical behavior
Target FormDisc / PlateCompatible with sputtering cathodes
Diameter25 – 200 mm (custom)Fits standard RF sputtering systems
Thickness3 – 6 mm (typical)Influences target lifetime
Sputtering ModeRF magnetron sputteringSuitable for compound targets
Backing PlateOptional (application-dependent)Improves thermal stability

Comparison with Related Lithium Targets

MaterialKey AdvantageTypical Application
Lithium Tetrachloroaluminate (LiAlCl₄)High lithium activity, halide chemistrySolid-state electrolyte films
Lithium Oxide (Li₂O)Oxide stabilityDielectric & battery films
Lithium PhosphateChemical robustnessSolid electrolyte research

FAQ

QuestionAnswer
Is LiAlCl₄ suitable for RF sputtering?Yes, RF magnetron sputtering is recommended.
Can target size and purity be customized?Yes, dimensions and purity grades can be tailored.
How is moisture sensitivity handled?Targets are processed and packed under controlled, dry conditions.
Are bonded targets available?Yes, bonding solutions can be provided upon request.
Is a Certificate of Analysis available?Yes, CoA is available upon request.

Packaging

Our Lithium Tetrachloroaluminate Sputtering Targets are handled and packed under strictly controlled environments. Each target is vacuum-sealed or inert-gas packed with moisture-barrier protection and clearly labeled to ensure material integrity during storage and transportation.

Conclusion

Lithium Tetrachloroaluminate Sputtering Targets (LiAlCl₄ Targets) provide reliable composition control and process compatibility for advanced lithium-based thin film research. With careful material handling, flexible customization options, and consistent quality control, these targets are well suited for solid-state battery development and next-generation energy material studies.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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