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Copper Zinc Telluride Sputtering Target

ST0923 Copper Zinc Telluride Sputtering Target, CuZnTe, CZT

Chemical FormulaCuZnTe
Catalog No.ST0923
CAS NumberN/A
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Copper Zinc Telluride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Copper Zinc Telluride Sputtering Target Description

Copper Zinc Telluride Sputtering Target is a specialized material utilized in the sputter deposition process, a widely used technique for producing thin films in electronics and optoelectronics. During this process, the Copper Zinc Telluride Sputtering Target is bombarded with high-energy ions in a vacuum chamber, causing atoms or particles to be ejected from the target. These ejected particles then deposit onto a substrate, forming a thin film with the desired properties.

Related Product: CIGS Copper Indium Gallium Selenide Sputtering Target

Copper Zinc Telluride Sputtering Target Specifications

Compound FormulaCuZnTe
Molecular WeightN/A
AppearanceGray target
Melting PointN/A
Density (g/cm3)N/A
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Copper Zinc Telluride Sputtering Target Handling Notes

Indium bonding is recommended for Copper Zinc Telluride Sputtering Targets due to the material’s characteristics that are less suitable for sputtering, such as brittleness and low thermal conductivity. Copper Zinc Telluride has low thermal conductivity and is prone to thermal shock, making indium bonding a practical solution to ensure stable and effective sputtering performance.

Copper Zinc Telluride Sputtering Target Application

Copper Zinc Telluride Sputtering Target is widely utilized in the production of thin films for applications in photovoltaic cells, thermoelectric devices, and optoelectronic components.

Copper Zinc Telluride Sputtering Target Packaging

Our Copper Zinc Telluride Sputtering Targets are meticulously handled during storage and transportation to ensure they maintain their quality and integrity in their original condition.

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TFM offers Copper Zinc Telluride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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