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VD0543 Cobalt (Co) Evaporation Materials

Material Type: Cobalt
Symbol: Co
Atomic Weight: 58.933195
Atomic Number: 27
Color/Appearance: Lustrous, Metallic, Grayish Tinge

TFM is a leading provider of high-purity cobalt evaporation materials, offering a broad selection of evaporation products. As a top manufacturer and supplier, we deliver cobalt materials in various forms, including powders, granules, and custom shapes tailored to meet specific requirements. Our extensive range ensures that we can accommodate a wide variety of applications.

Introduction

Cobalt (Co) Evaporation Materials are widely used in thin film deposition for magnetic, electronic, catalytic, and wear-resistant coatings. Thanks to cobalt’s unique magnetic behavior, thermal stability, and alloying versatility, high-purity cobalt evaporation materials are essential in both research and industrial Physical Vapor Deposition (PVD) processes where film consistency and compositional control are critical.

Detailed Description

Cobalt evaporation materials are produced from high-purity cobalt through refined melting, casting, and sizing processes to ensure uniform composition and stable evaporation behavior. They are available in multiple physical forms—such as pellets, granules, shots, or pieces—optimized for different evaporation sources including boats, crucibles, and liners.

Material purity and morphology play a key role in deposition performance. Carefully controlled particle size and surface condition help reduce spitting, improve evaporation rate stability, and ensure uniform film thickness. Cobalt’s relatively high melting point requires well-controlled heating, making these materials suitable for both thermal evaporation and electron-beam (e-beam) evaporation systems.

Customized purity grades and forms can be supplied to support applications ranging from exploratory R&D to repeatable production coating processes.

Applications

  • Magnetic thin films and spintronic research

  • Semiconductor and microelectronic coatings

  • Wear-resistant and hard coatings

  • Catalytic and functional surface layers

  • Alloy film deposition and materials research

Technical Parameters

ParameterTypical Value / RangeImportance
MaterialCobalt (Co)Magnetic and functional metal
Purity99.9% – 99.99%Impurity control affects film properties
FormPellets, granules, shots, piecesCompatible with evaporation sources
Melting Point~1495 °CDefines evaporation conditions
Deposition MethodThermal / E-beam evaporationPVD process flexibility
PackagingVacuum-sealed, inert protectedPrevents oxidation and contamination

Comparison with Related Evaporation Materials

MaterialKey AdvantageTypical Application
Cobalt (Co)Magnetic functionalityMagnetic & electronic films
Nickel (Ni)Corrosion resistanceBarrier and alloy films
Iron (Fe)Cost-effective magnetismStructural and research films

FAQ

QuestionAnswer
Can purity and particle size be customized?Yes, purity grade and physical form can be tailored to your process.
Is cobalt suitable for thermal evaporation?Yes, with proper temperature control; e-beam is also widely used.
How is oxidation prevented?Materials are vacuum-sealed or packed under inert atmosphere.
Which industries commonly use cobalt evaporation materials?Semiconductor, magnetic materials, coatings, catalysis, and R&D.
Is documentation available?Certificate of Analysis can be provided upon request.

Packaging

Our Cobalt (Co) Evaporation Materials are meticulously labeled and packed under vacuum or inert atmosphere to preserve purity. Protective cushioning and export-grade packaging ensure safe delivery and prevent contamination during storage and transportation.

Conclusion

Cobalt (Co) Evaporation Materials provide reliable evaporation performance, high purity, and flexible form options for demanding thin film deposition applications. With consistent quality and customizable specifications, they are well suited for magnetic, electronic, and functional coating technologies.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Ordering Table 

Material Size Quantity Purity Part Number
Cobalt 1/4" Dia. x 1/4" Length 1 lb./454 g 99.95% EVMCO35QXQ
Cobalt 1/4" Dia. x 1/4" Length 25 g 99.95% EVMCO35QXQA
Cobalt 1/4" Dia. x 1/4" Length 50 g 99.95% EVMCO35QXQB
Cobalt 1/4" Dia. x 1/4" Length 100 g 99.95% EVMCO35QXQD
Cobalt 1/4" Dia. x 1/4" Length 250 g 99.95% EVMCO35QXQJ
Cobalt 1/4" Dia. x 1/4" Length 25 g 99.99% EVMCO40QXQA
Cobalt 1/4" Dia. x 1/4" Length 100 g 99.99% EVMCO40QXQD
Cobalt 1/8" Dia. x 1/8" Length 1 lb. 99.95% EVMCO35EXE
Cobalt 1/8" Dia. x 1/8" Length 25 g 99.95% EVMCO35EXEA
Cobalt 1/8" Dia. x 1/8" Length 50 g 99.95% EVMCO35EXEB
Cobalt 1/8" Dia. x 1/8" Length 100 g 99.95% EVMCO35EXED
Cobalt 1/8" Dia. x 1/8" Length 250 g 99.95% EVMCO35EXEJ
Cobalt 1/8" Dia. x 1/8" Length 500 g 99.95% EVMCO35EXET
Cobalt 1/8" Dia. x 1/8" Length 25 g 99.99% EVMCO40EXEA
Cobalt 1/8" Dia. x 1/8" Length 100 g 99.99% EVMCO40EXED

 

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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