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Undoped Silicon Evaporation Materials

VD0578 Undoped Silicon Evaporation Materials, Si

Material：Silicon (Si) (undoped)
Purity：99.9% ~ 99.999%
Shape：Powder/ Granule/ Custom-made
Color/Appearance: Dark Gray with a Bluish Tinge, Semi-Metallic

TFM stands out as a top-tier producer and supplier of high-purity undoped silicon evaporation materials, alongside a diverse range of other evaporation materials. We provide these materials in both powder and granule forms to suit various applications. Additionally, we can customize our products to meet specific requirements upon request.

MSDS File

Undoped Silicon Evaporation Materials Description

Silicon is a unique metalloid, exhibiting properties characteristic of both metals and nonmetals. It has a high melting point of 1,410°C, a density of 2.32 g/cc, and at 1,337°C, its vapor pressure is around 10^-4 Torr. Silicon is brittle and prone to chipping, but it plays a crucial role as a semiconductor, especially in the electronics and computer industries. It is frequently doped with elements such as arsenic, phosphorus, or boron to modify its electrical properties for various applications.

Silicon is highly inert, showing little reactivity with water and acids, although it can be dissolved in silicates by hot alkaline lyes. In its pure form, silicon appears as dark gray, metallic, and shiny crystals. It possesses excellent thermal conductivity, yet has very low electrical conductivity when pure. When alloyed with aluminum, silicon enhances the strength and reduces the weight of the alloy.

In the field of deposition processes, high-purity undoped silicon evaporation materials are crucial for producing high-quality deposited films. TFM specializes in manufacturing silicon evaporation materials with purity levels of up to 99.999%. Our rigorous quality assurance procedures ensure the reliability and superior performance of our products.

silicon undoped evaporation materials

Undoped Silicon Evaporation Materials Specification

Material TypeUndoped Silicon
SymbolSi
Color/AppearanceDark Gray with a Bluish Tinge, Semi-Metallic
Melting Point1,410 °C
Density2.32 g/cc
Thermal Conductivity150 W·m-1·K-1 (25°C)
Thermal Expansion2.6 x 10-6/K (25°C)
Bulk Resistivity0.005-0.020 OHM-CM
SynonymsUndoped Silicon Pellets, Undoped Silicon Pieces, Undoped Silicon Evaporation Pellet, Undoped Si Pellets, Undoped Si Pieces, Undoped Si Evaporation Pellet

Undoped Silicon Evaporation Materials Application

  • Deposition Processes: Silicon evaporation materials are essential for various deposition techniques, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: These materials are also employed in optics for applications such as wear protection, decorative coatings, and display technologies.

Undoped Silicon Evaporation Materials Packaging

We meticulously handle our undoped silicon evaporation materials to ensure they remain undamaged during storage and transportation, preserving their quality and integrity in their original condition.

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TFM offers undoped silicon evaporation materials in a range of forms, purities, sizes, and price points. We specialize in manufacturing high-purity e-beam evaporation materials, focusing on achieving the highest density and smallest average grain sizes possible. For information on current prices for evaporation pellets and other deposition materials not listed, please send us an inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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