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Chromium Cobalt Evaporation Materials

VD0605 Chromium Cobalt Evaporation Materials, Cr/Co

Catalog No.VD0605
MaterialChromium Cobalt (Cr/Co)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

TFM is a leading producer of high-purity chromium cobalt evaporation materials, meticulously crafted through rigorous quality assurance processes to ensure exceptional product reliability. We offer these materials in a variety of forms, including tablets, granules, rods, and wires, catering to diverse industry needs.

MSDS File

Chromium Cobalt Evaporation Materials Overview

TFM offers high-purity chromium cobalt evaporation materials, an alloy composed of chromium (Cr) and cobalt (Co), specifically designed for critical deposition processes. These materials, with purity levels reaching up to 99.9995%, are essential for achieving superior quality in deposited films. TFM ensures consistent product reliability through stringent quality assurance measures.

Applications of Chromium Cobalt Evaporation Materials

  • Deposition Processes: Ideal for various deposition techniques, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics and Coatings: Commonly used in optics for wear protection, decorative coatings, and display technologies.

Packaging of Chromium Cobalt Evaporation Materials

TFM takes great care in packaging our chromium cobalt evaporation materials to prevent any damage during storage and transportation, ensuring that the products maintain their high quality upon arrival.

Get in Touch

TFM is a trusted manufacturer and supplier of high-purity chromium cobalt evaporation materials, as well as a wide range of other evaporation pellets. Our materials are available in both powder and granule forms, with customization options to meet specific requirements. For current pricing or to inquire about additional deposition materials not listed, please reach out to us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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