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Iron Aluminum Evaporation Materials

VD0626 Iron Aluminum Evaporation Materials, Fe/Al

Catalog No.VD0626
MaterialIron Aluminum (Fe/Al)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) specializes in the production of high-purity iron aluminum evaporation materials. Our rigorous quality assurance processes ensure that each product meets the highest standards of reliability and performance. We offer these materials in a variety of forms, including tablets, granules, pellets, and powder, catering to diverse application needs.

MSDS File
Iron Aluminum Evaporation Materials Overview

Thin-Film Mat Engineering (TFM) offers high-purity iron aluminum evaporation materials, a key alloy comprising iron (Fe) and aluminum (Al). These materials are crucial for achieving superior quality films in various deposition processes. With purity levels reaching up to 99.9995%, our iron aluminum evaporation materials are produced with stringent quality assurance to ensure exceptional reliability and performance.

Applications of Iron Aluminum Evaporation Materials

Iron aluminum evaporation materials are used in various applications, including:

  • Deposition Processes: Suitable for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Applied in wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Handling

To ensure the highest quality of our iron aluminum evaporation materials, we handle and package them with care. This meticulous approach helps prevent damage during storage and transportation, preserving the products’ integrity.

Contact Us

At TFM, we are a leading provider of high-purity iron aluminum evaporation materials and offer a wide range of other evaporation products. Our materials are available in both powder and granule forms, with custom options upon request. For current pricing and details on additional deposition materials, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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