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Tin Zinc Evaporation Materials

VD0648 Tin Zinc Evaporation Materials, Sn/Zn

Catalog No.VD0648
MaterialTin Zinc (Sn/Zn)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM is a premier producer and supplier of high-purity tin zinc evaporation materials, alongside a diverse selection of other evaporation substances. We provide our materials in both powder and granule formats, and we are also equipped to offer customized options tailored to specific needs.

MSDS File

Tin Zinc Evaporation Materials Overview

Our tin zinc evaporation materials are high-purity alloys composed of tin (Sn) and zinc (Zn). These materials are essential for achieving superior quality in deposited films during various deposition processes. At TFM, we produce evaporation materials with a purity of up to 99.9995%, adhering to stringent quality assurance practices to ensure product reliability.

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Applications of Tin Zinc Evaporation Materials

  • Deposition Processes: Ideal for use in semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Coatings: Suitable for wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our tin zinc evaporation materials are meticulously labeled and tagged for efficient identification and quality control. We ensure that all materials are carefully packaged to prevent damage during storage and transportation.

Contact Us

TFM is a leading supplier of high-purity tin zinc evaporation materials, available in various forms including tablets, granules, rods, and wires. Customized shapes and quantities can be provided upon request. We also offer a range of evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and additional information, please send us an inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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